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Wednesday 9th July 2003
Chartered Semiconductor Manufacturing has signed a multi-year agreement to provide volume manufacturing for Infineon Technologies. The manufacturing agreement includes Infineon’s OptiMOS technology with potential extension to its CoolMOS process.
Wednesday 9th July 2003
EV Group (EVG) has concluded an order for a complete micro-electro-mechanical system (MEMS) process line at Silex Microsystems of Sweden.
Wednesday 9th July 2003
Cool Chips and Rolls-Royce have signed a term sheet with a view to a license agreement that would give Rolls-Royce exclusive, worldwide rights to use Cool Chips’ solid-state cooling technology.
Tuesday 8th July 2003
Infineon Technologies' Emerging Technology Labs team has developed a fault-tolerant, self-organising embedded microcontroller network, which, coupled with sensors and LEDs, can be integrated into industrial or commercial textiles.
Tuesday 8th July 2003
Infineon Technologies' Emerging Technology Labs team has developed a fault-tolerant, self-organising embedded microcontroller network, which, coupled with sensors and LEDs, can be integrated into industrial or commercial textiles.
Tuesday 8th July 2003
Founded in 1986, the SEZ Group is the pioneer of single-wafer, wet-cleaning systems used in the fabrication of the integrated circuits (ICs) used to power today’s state-of-the-art electronic devices. SEZ delivers innovative, highly reliable products designed to meet the increasingly complex and demanding needs of today’s leading semiconductor manufacturers—delivering superior productivity at a low cost of ownership. The company’s proprietary spin-processing technology serves as the chief architecture within its broad portfolio of wafer cleaning and decontamination solutions. The company attributes its success to date on a number of factors, which include its global presence and localized support capabilities, its strong balance sheet and its proven technology and market leadership in anticipating chipmakers’ current and future requirements. SEZ helped pioneer the single-wafer wet-clean market over a decade ago, introducing its first single-wafer tool in 1990 and debuting its 300-mm single-wafer wet clean system in 1997. The company has 700 systems, representing almost 1,000 wet-clean chambers, installed worldwide—totaling approximately 80 percent of all the single-wafer wet-clean tools currently in the field. In addition, more than 40 percent of the single-wafer systems SEZ sold in 2002 were 300-mm tools, demonstrating the growing demand for single-wafer processing in the manufacturing of these advanced wafer diameters. To support its growing global customer base, SEZ maintains a significant presence throughout Europe, Asia-Pacific, Japan and North America. Employing more than 600 people around the world, the company reported sales of CHF 199 million / US$128 million in 2002. Registered in Zurich, Switzerland, SEZ Holding has been listed on the SWX Swiss Exchange under the symbol SEZN since 1996. Contact Information Corporate PR Contact Heinz Oyrer Phone: +43 4242 204-455 Fax: +43 4242 204-469 Email: h.oyrer@at.sez.com Investor Relations Monika Kraker Phone: +43 4242 204-455 Fax: +43 4242 204-469 Email: m.kraker@at.sez.com
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Tuesday 8th July 2003
Click here for more information about the Da Vinci Platform Founded in 1986, the SEZ Group is the pioneer of single-wafer, wet-cleaning systems used in the fabrication of the integrated circuits (ICs) used to power todays state-of-the-art electronic devices. SEZ delivers innovative, highly reliable products designed to meet the increasingly complex and demanding needs of todays leading semiconductor manufacturers—delivering superior productivity at a low cost of ownership. The companys proprietary spin-processing technology serves as the chief architecture within its broad portfolio of wafer cleaning and decontamination solutions. The company attributes its success to date on a number of factors, which include its global presence and localized support capabilities, its strong balance sheet and its proven technology and market leadership in anticipating chipmakers current and future requirements. SEZ helped pioneer the single-wafer wet-clean market over a decade ago, introducing its first single-wafer tool in 1990 and debuting its 300-mm single-wafer wet clean system in 1997. The company has 700 systems, representing almost 1,000 wet-clean chambers, installed worldwide—totaling approximately 80 percent of all the single-wafer wet-clean tools currently in the field. In addition, more than 40 percent of the single-wafer systems SEZ sold in 2002 were 300-mm tools, demonstrating the growing demand for single-wafer processing in the manufacturing of these advanced wafer diameters. To support its growing global customer base, SEZ maintains a significant presence throughout Europe, Asia-Pacific, Japan and North America. Employing more than 600 people around the world, the company reported sales of CHF 199 million / US$128 million in 2002. Registered in Zurich, Switzerland, SEZ Holding has been listed on the SWX Swiss Exchange under the symbol SEZN since 1996. Contact Information Corporate PR Contact Heinz Oyrer Phone: +43 4242 204-455 Fax: +43 4242 204-469 Email: h.oyrer@at.sez.com Investor Relations Monika Kraker Phone: +43 4242 204-455 Fax: +43 4242 204-469 Email: m.kraker@at.sez.com Click here for more information about the Da Vinci Platform
Monday 7th July 2003
X-FAB Semiconductor Foundries announced an expansion of its MEMS product line to include surface micromachining technology for absolute pressure sensors. The technology enables integration of absolute pressure sensors with X-FAB's CMOS technologies. The sensors can also be implemented as discrete components.
Monday 7th July 2003
EV Group (EVG) has shipped and successfully installed a 200mm hot embossing and nanoimprinting system at the CEA-LETI research centre in Grenoble, France. The system will be used in collaboration between CEA-LETI and CNRS-LTM on micro- and nanotechnology research in the area of biochip and microfluidic devices.
Monday 7th July 2003
SUSS MicroTec announced new capabilities for cost-effective 1X full-field lithography (1XFFL) with a package of four new technologies. Known collectively as SupraYield, the enhancements provide a high-performance 1XFFL solution for advanced thick-resist applications, such as wafer-level packaging, MEMS and optoelectronics.
Monday 7th July 2003
Solar cell panel production is to be developed in Uppsala, Sweden, with the first products coming in five years’ time. An agreement between three major companies, two investment funds, and a spin-off company from the Uppsala University Angstrom Solar Centre will be the launch pad for the new development.
Monday 7th July 2003
XenICs introduced its new infrared focal plane camera XEVA-USB. This camera has a near-infrared InGaAs imager with a resolution of 320x256pixels. The system is sensitive to radiation of wavelengths between 0.9mm and 1.7mm. This part of the spectrum is fully complementary to the sensitivity range of standard CCD cameras.
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Monday 7th July 2003
Surface Technology Systems (STS) unveiled its Pro family of plasma etch and deposition tools aimed at the transition from the "technology driven" era of micro-electro-mechanical system (MEMS) technology into volume production.
Monday 7th July 2003
Texas Instruments plans to be groundbreaking a new 300mm fab by the end of 2005 in Richardson, Texas.
Monday 7th July 2003
Unitive Semiconductor Taiwan (UST) has installed a 300mm line for electroplate bumping.
Monday 7th July 2003
Cirrus Logic has agreed to sell its semiconductor test operation assets in Texas to ChipPAC.
Monday 7th July 2003
The German Federal Ministry of the Interior (BMI) and Infineon Technologies have signed a Memorandum of Understanding (MoU) concerning Information Technology (IT) security.
Monday 7th July 2003
EV Group (EVG) has shipped and successfully installed a 200mm hot embossing and nanoimprinting system at the CEA-LETI research centre in Grenoble, France.
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Monday 7th July 2003
iSuppli believes that a supply/demand imbalance is on the cards for the semiconductor market before the end of the year as a result of most of the excess inventory being eliminated from the supply chain.
Monday 7th July 2003
STMicroelectronics claims the world's first volume production embedded Flash memory in an advanced 180nm CMOS technology. ST's 180nm embedded Flash technology offers the world's smallest cell size, with each Flash cell occupying just 0.37micron2.
Monday 7th July 2003
Motorola Labs announced results from its carbon nanotechnology research for use in flat panel displays and other applications.
Monday 7th July 2003
Researchers at Infineon Technologies claim to have set a new world-speed record for silicon chips. The company’s Munich research labs has fabricated carbon-doped silicon germanium (SiGe:C) bipolar ICs that reach an operating frequency of more than 110GHz with minimum power consumption. By way of comparison, silicon-based processors in CMOS used in PCs run with top speeds of less than 4GHz.
Monday 7th July 2003
Solar cell panel production is to be developed in Uppsala, Sweden, with the first products coming in five years' time.
Monday 7th July 2003
Rite Track has bought the 8X and 9X track product lines from ASML. These products were inherited from ASML’s acquisition of Silicon Valley Group (SVG).

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