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News

News

Thursday 11th June 2026

The FAMES payoff begins

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Tuesday 9th June 2026

Presto Engineering and Menta announce collaboration

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Friday 5th June 2026

Cadence unveils Autonomous Virtual Engineer for chip design

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Friday 5th June 2026

CEA-Leti presents Die-to-Wafer Hybrid Bonding at 1 μm pitch

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Friday 5th June 2026

MIT to establish regional quantum hub

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Friday 5th June 2026

Infineon joins NVIDIA’s MGX™ AI Factory ecosystem

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Friday 5th June 2026

Imec and EV Group demonstrate wafer-to-wafer hybrid bonding

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Wednesday 3rd June 2026

Vista Equity Partners and Cambium launch Vector Core Compute

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Wednesday 3rd June 2026

Bringing grayscale lithography closer to production reality

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Tuesday 2nd June 2026

Nordic Semiconductor brings AI-assisted development to the entire product lifecycle

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Monday 1st June 2026

Wiwynn selects TRI

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Monday 1st June 2026

Rambus enables next-generation AI PC memory

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Monday 1st June 2026

DP Patterning wins Norrköping Tech Award 2026

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Monday 1st June 2026

Cyient Semiconductors receives Edelweiss equity investment

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Thursday 28th May 2026

HUAWEI presents the Tau (τ) Scaling Law

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Thursday 28th May 2026

Europe acts with RESOLVE

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Thursday 28th May 2026

AMD to invest $10 billion+ in Taiwan

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Thursday 28th May 2026

Quantum Technology Solutions to scale US quantum manufacturing

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Thursday 28th May 2026

Arteris Technology adopted by Li Auto for intelligent vehicles

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Thursday 28th May 2026

imec presents quantum dot qubit device using High NA EUV lithography

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Thursday 28th May 2026

X-FAB and Cadence strengthen collaboration

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Tuesday 26th May 2026

DTU Nanolab expands silicon DRIE infrastructure with cassette-loading etch system from Samco

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Thursday 21st May 2026

Honey-like heat flow

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Thursday 21st May 2026

Advantest ranks Global #1