+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Automated Thickness Measurement System Speeds Production

News


The labor-intensive, manual process of recording precise measurements across various wafer coordinates is now programmable for automated data collection and report generation.

ACU-THIK is an automated thickness measurement tool incorporating dual contact probes for high accuracy inspection of semiconductor wafers. Six Heidenhain measuring devices are integrated into the ACU-THIK system which can be configured to accommodate wafer diameters of 100 mm "“ 400 mm and larger. Acu-Gage customers can have a system customized for their precise needs to make differential gage measurement faster and easier.

Diagnosing as well as controlling thickness, bow and warp in semiconductor wafer production is now automated when using ACU-THIK. Users can preprogram multiple pattern operations to fulfill planned production cycles. Additionally, the system supports robotics integration to further free up operators for other important tasks.

ACU-THIK's automated measurements can improve quality-assured production yields by:
"¢ Calculating wafer thickness across X/Y points to resolution and repeatability of .00025mm/.00001 inch (10 millionths of an inch)
"¢ Determining the amount of bow deviation in an unclamped wafer established by three or more points at equidistant locations

"¢ Examining the entire wafer for warp by incorporating more comprehensive data points to provide a more useful measurement of the full wafer shape

"¢ Accelerating throughput with 15 data points of X/Y thickness measurements in under two minutes as well as increasing accuracy of wafer thickness and flatness definitions

"¢ Validating pre- and post-measurement integrity of data collection for each wafer inspection - ACU-THIK calculates the thickness of a certified gage block prior to as well as after the wafer inspection routine is complete.

The X/Y location for each thickness data point automatically outputs to Excel for further analysis. Programming software runs on Windows 7. Both hardware and software come delivered as a turnkey system including installation and training.

Sono-Tek to demonstrate SPT200 Photoresist Coating
Microelectronics industry education and workforce challenges explored
PEMTRON to spotlight semiconductor inspection solutions
OMNIVISION introduces 'smallest camera module'
Socionext joins the Global Semiconductor Alliance
Imec unveils CMOS-based 56Gb/s zero-IF D-band beamforming transmitter
Flip chip technology market to reach $45.22 billion in 2032
EV Group and Fraunhofer IZM-ASSID expand partnership
Company founder Ayhan Busch celebrates her 90th birthday
Moxa 5G expert to discuss Private 5G Networks
Nordson Test & Inspection to showcase Advanced Semiconductor Technologies
Greene Tweed extends global reach
5G chipset market worth $92.billion in 2030
KYZEN to showcase Multi-Process Power Module Cleaner
Fractilia has introduced FAME OPC for improved OPC modeling
Critical Manufacturing and RoviSys expand strategic alliance
Mouser Electronics and Analog Devices publish Collaborative eBooks
Infineon introduces Product Carbon Footprint data for customers
Alphawave Semi collaborates with Arm
VIS and NXP to establish fab JV
Infineon drives decarbonisation and digitalisation
The future of flexible technology?
CEA-Leti reports three-layer integration breakthrough
Nidec Advance Technology signs agreement with Synergie Cad Group
Flip-chip die bonder promises speed improvement
Raspberry Pi selects Hailo to enable advanced AI capabilities
Gartner forecasts worldwide AI chips revenue to grow 33% in 2024
Imec demonstrates die-to-wafer hybrid bonding with a Cu interconnect pad pitch of 2µm
Doubling throughput of layer transfer technology
Accelerating lab to fab
Advanced packaging in the spotlight
ASML and imec open joint High NA EUV Lithography Lab
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: