Loading...
News Article

Nearfield Instruments secures €135 million in funding round

News

Nearfield Instruments has announced the successful closure of a €135 million Series-C funding round.

The oversubscribed funding round is led by two new major investors, Walden Catalyst, an industry leading US venture capital firm helping the next generation of category-defining businesses in deep-tech, and Temasek, a global investor that also looks into opportunities in emerging technologies to solve complex and high impact challenges, and address market inflections. M&G Investments, a leading global asset manager, through its Catalyst strategy, is acting as a co-investor. The success of this round is further underscored by the participation of existing investors Innovation Industries, Invest-NL, and ING.


The growing complexities in advanced semiconductor manufacturing, driven by the surge in demand for higher performing and lower energy consuming chips, are addressed by Nearfield’s innovative process control solutions. These include the QUADRA 3D metrology system that provides non-destructive, high- throughput, and high-resolution metrology capabilities. Nearfield is deeply engaged with most major chip manufacturers globally, and QUADRA is fully validated and deployed in high-volume manufacturing.


Dr. Hamed Sadeghian, Co-Founder and CEO of Nearfield Instruments: "We are thrilled that Nearfield’s' QUADRA 3D metrology system has been fully integrated into the first major high-volume semiconductor manufacturing fab. This milestone solidifies our pioneering role in advancing critical metrology for leading-edge nodes. With significant contributions from investment leaders, we are well positioned to meet the growing demand for Metrology & Inspection in the coming decade. This funding will enable us to ramp up production capacity, expand our product portfolio, and strengthen our position as a key player in the semiconductor equipment industry."


The funding round is the second largest capital raise in the semiconductor fabrication equipment market in Europe and the US in the past 5 years, according to Mergermarket.


Young Sohn, Founding Managing Partner at Walden Catalyst, comments: “Advanced semiconductors are the key pillars for global innovation and growth. The next generation of semiconductors will be driven by Advanced Lithography and 3D Integration, with smaller features, deeper trenches, and tighter tolerances. The high-volume manufacturing of these next gen devices requires new process control tools to enable higher yield and throughput, and Nearfield's metrology solutions are critical for solving these process control challenges. We are excited to partner with Hamed and his world-class team to further accelerate Nearfield's growth.”

As a Netherlands-based scale-up, Nearfield is embedded in the strong Dutch ecosystem of semiconductor innovation and investments, an industry that is expected to reach USD 1 trillion in global revenue by 2029. The funding round is the largest deep-tech investment round in the Netherlands and is yet another testimony of the country’s leading position in semiconductors globally.


Eric Meurice, Chairman of the Nearfield Instruments Supervisory Board, adds: “This fantastic outcome enables us to accelerate Nearfield’s efforts to provide unique solutions to meet the industry's metrology and inspection needs for the most advanced nodes. Providing process control and yield improvement is critical in this global industry. It is great to see the continued support of our shareholders combined with the onboarding of new industry-leading investors who will reinforce our global view and network and cement the company's position as the leader in Metrology & Inspection.”

Silicon photonics: accelerating growth in the race for high-speed optical interconnects
CCD-in-CMOS technology enables ultra-fast burst mode imaging
2025 6G A look forward
Critical Manufacturing climbs Deloitte’s Technology Fast 50
Semiconductors: The most important thing you probably know the least about
Imec and partners unveil SWIR sensor with lead-free quantum dot photodiodes
Lattice introduces small and mid-range FPGA offerings
SEMI and SMT inspection solutions at NEPCON Japan 2025
Nordic Semiconductor and Kigen demonstrate Remote SIM Provisioning for Massive IoT
Spirent collaborates with Siemens
Quobly forges strategic collaboration with STMicroelectronics
New standards in pressure measurement systems for the semiconductor industry
IBM delivers optics breakthrough
Semiconductor equipment sales to reach $139 Billion in 2026
Marvell introduces 1.6 Tbps LPO Chipset
ACM research strengthens Atomic Layer Deposition portfolio
CEA-Leti demonstrates embedded FeRAM platform compatible with 22nm FD-SOI node
Lattice introduces small and mid-range FPGA offerings
Solace unlocks full potential of event-driven integration
Advantest to showcase latest test solutions at SEMICON Japan 2024
CEA-Leti device integrates light sensing and modulation
Nordic launches Thingy:91 X prototyping platform for cellular IoT and Wi-Fi locationing
Imec achieves seamless InP Chiplet integration on 300mm RF Silicon Interposer
High-precision SMU
Powering India’s energy future
China’s Nvidia probe puts global investors ‘on notice’
POET Technologies appoints new director
Imec demonstrates core building blocks of a scalable, CMOS-fab compatible superconducting digital technology
Imec proposes double-row CFET for the A7 technology node
ULVAC launches new deposition system
Beebolt and SEMI Announce Strategic Partnership to Drive Supplier Resilience and Agility
esmo group introduces Automated Final Test Manipulator
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: