Loading...
News Article

Newly optimized entry-level deposition system from Kurt J. Lesker

News

Kurt J. Lesker Company has launched the 2018 NANO 36 Thin Film Deposition System Platform, a newly optimized entry-level deposition system that is fully capable for glovebox integration. The platform offers increased deposition capabilities and substrate platen options while decrease system footprint. The NANO 36 provides an accessible price point and exceeds all KJLC quality standards.

"Our products are used by the world's largest and most well-known manufacturers, research facilities, and scientists," said Kurt J. Lesker IV, president and CEO at Kurt J. Lesker Company. "In response to increasing demand for new and enhanced high-quality vacuum equipment, our R&D team created the NANO 36 for use within the controlled atmosphere of a glove box."

The 2018 NANO 36 Thin Film Deposition System Platform is compatible with multiple deposition techniques and substrate fixture options.

Breakthrough microactuator driving system
Arteris 'revolutionises' semiconductor design with FlexGen
EU funding boosts Europe's semiconductor production
eBeam Initiative member companies take centre stage
Wooptix secures over €10 million in Series C funding
Providing a path to low power and scalable quantum ICs
EV Group to showcase temporary wafer bonding for HBM & 3D DRAM in Korea
$1 trillion by 2030: the semiconductor devices industry is on track
Exploring semiconductor and superconducting photodetectors in quantum technologies
Project “GENIAL!”: Joint electronics roadmap for innovations in the automotive value chain
Aitomatic's DXA Factory Platform to power next billion AI agents
ERS electronic opens Advanced Packaging facility
Advantest unveils T5801 Ultra-High-Speed Memory Test System
SK hynix acquires 'TISAX' Certification
LQDX and Arizona State University sign semiconductor packaging collaboration agreement
SurplusGLOBAL launches AI-powered Global Platform 'SemiMarket'
Accuron Technologies acquires majority stake in Trymax Semiconductor
3M joins consortium to accelerate semiconductor technology in the US
EdgeCortix to expand into Riyadh
MACOM European Semiconductor Centre (MESC) wins contract
Laser Photonics propels R&D efforts in wafer marking
Mobix Labs wins U.S. Defense grant
Semtech appoints Jason Green as Executive VP and CCO
Teradyne and Infineon form strategic partnership
Advantest opens registration for International VOICE 2025 Developer Conference, May 12-14
Fujifilm to invest 4 billion yen in Belgium
CEA-Leti announces FAMES Pilot Line in Nature Reviews Electrical Engineering
Photonic Integrated Circuit market to surpass $50B by 2035
McLaren Racing announces Greene Tweed as an Official Partner
Infineon outperforms expectations
North American semiconductor industry 'unites'
TotalEnergies to supply 1.5 TWh to STMicroelectronics
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: