+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Graphene sensors that could revolutionise the IoT

News

Researchers at The University of Manchester have devised graphene sensors embedded into RFIDs, which have the potential to revolutionise the Internet of Things (IoT).

By layering graphene-oxide (a derivative of graphene) over graphene to create a flexible heterostructure the team have developed humidity sensors for remote sensing with the ability to connect to any wireless network.

Graphene was the world's first two-dimensional material isolated in 2004 at The University of Manchester, it is stronger than steel, lightweight, flexible and more conductive than copper.

Since then a whole family of other 2D materials have been discovered and continues to grow.

Using graphene and other 2D materials, scientists can layer these materials, similar to stacking bricks of Lego in a precisely chosen sequence known as van der Waals heterostructures to create high-performance structures tailored to a specific purpose.

As reported in Scientific Reports, the ground breaking nature of this development is that such sensors can be printed layer-by-layer for scalable and mass production at very low cost. The device also requires no battery source as it harvests power from the receiver.

Sensors with a RFID enabler are at the heart of the IoT. This new development can provide various applications such as battery-free smart wireless monitoring for manufacturing processes that are sensitive to moisture, food safety, healthcare and nuclear waste.

The developed technique has the potential to simplify how the information is gathered through its wireless system, nor is it is limited to a particular wireless network and has the ability to be compatible with networks including WiFi and 5G.

Dr Zhirun Hu who led the work said: The excitement does not end with this new application here, but leads to the future possibilities of integrations of this technique with other 2D materials to open up a new horizon of wireless sensing applications.

Professor Sir Kostya Novoselov, who won the Nobel Prize in Physics and coordinated the project, added: It is the first example of the printable technology where several 2D materials come together to create a functional device immediately suitable for industrial applications. The Internet of Things is the fast growing segment of technology, and I'm sure that 2D materials will play an important role there.

Biden-Harris Administration unveils preliminary terms with GlobalWafers
UK-India Technology Security Initiative launches in New Delhi
Chiplets increase performance and lower cost
Physik Instrumente opens Technology Hub in Southwest Germany
42 Technology partners with INFICON
Imec achieves record-low charge noise for Si MOS quantum dots
Infineon and Amkor sign MoU
Lattice extends Small FPGA portfolio
Nearfield Instruments secures €135 million in funding round
Experts urge EU to increase investment in photonics or risk falling behind China
Reality AI Explorer Tier offers free AI/ML development access
AEM introduces new generation of Automated Burn-In Systems
NPUs are emerging as the main rival to Nvidia’s AI dominance, says DAI Magister
Camtek receives a $20M order from a Tier-1 OSAT
Free samples of every STMicroelectronics NPI IC available from Anglia
NY CREATES and SEMI sign MoU
Major government investment to 'propel' Canada
QuickLogic announces $5.26 million contract award
ASNA and Athinia collaborate
Global sales forecast to reach record $109 billion in 2024
AMD to acquire Silo AI
Nanotronics unveils 'groundbreaking' Gen V AI Model
Aitomatic unveils SemiKong
Biden-Harris Administration reveals first CHIPS for America R&D facilities and selection processes
Collaboration to produce cutting-edge AI accelerator chips
Oxford Ionics breaks global quantum performance records
Adeia wins ECTC Award for paper on “Fine Pitch Die-to-Wafer Hybrid Bonding”
AEM introduces new generation of Automated Burn-In Systems
Sydney council forges vital semiconductor agreement
EV Group's EVG880 LayerRelease wins 2024 Best of West
Biden-Harris Administration to invest up to $1.6 billion
Cyient sets up subsidiary for semiconductor business
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: