+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Imotion series from Infineon reduces PCB size and R&D efforts

News

Infineon Technologies AG introduces smart IPM motor controllers featuring full hardware and software integration needed for BLDC motor drives of up to 80W without heatsink. The new iMOTION IMM100 series combines the motor controller IC and a 3-phase inverter stage in a single, highly compact 12 x 12 mm 2 PQFN package. This combination enables BOM count and PCB size reduction, thus lowering system cost. The smallest footprint of the motor drive IC makes it a perfect fit for space restrained home appliances like hair dryers, kitchen hoods, ceiling and air conditioner fans as well as pumps for dishwasher and washing machines. Additional applications include low-power fridge compressors, heating pumps and industrial pumps.

The IMM100 series offers two optimized variants to best serve the needs of design engineers. The T-variant features the highly sophisticated FOC algorithm integrated in the iMOTION MCE 2.0 (Motion Control Engine 2.0). This variant takes advantage of the easy-to-use software tools for system configuration and tuning. It can also be complemented with additional system level functionalities by using iMOTION scripting and, optionally, with PFC control.

Alternatively, with the IMM100 A-variant, engineers can implement proprietary motor control software by utilizing the fully programmable integrated ARM Cortex -M0 MCU – and still enjoy the benefits of complete hardware integration. In this case, the industry-standard ARM MCU IDE tools support the software design process, compiling and debugging. Both variants reduce R&D cycle time for the hardware design due to the high level of integration. Moreover, the T-variant significantly reduces the R&D cost and speeds up time-to-market thanks to production-ready MCE 2.0 software integration.

The iMOTION IMM100 series of motor control ICs features three different MOSFET-based power stages: 500 V / 6 Ω, 600 V / 1.4 Ω and 600 V / 0.95 Ω to best match designers’ performance and cost targets. These devices also offer flexible sensing options by supporting single-shunt or leg-shunt topologies (sensorless option), as well as supporting Hall sensors. Additionally, the IMM100 integrate multiple protection features, e.g. under-/over-voltage protection, over-current protection, rotor lock and shoot-through protection.

Biden-Harris Administration unveils preliminary terms with GlobalWafers
UK-India Technology Security Initiative launches in New Delhi
Chiplets increase performance and lower cost
Physik Instrumente opens Technology Hub in Southwest Germany
42 Technology partners with INFICON
Imec achieves record-low charge noise for Si MOS quantum dots
Infineon and Amkor sign MoU
Lattice extends Small FPGA portfolio
Nearfield Instruments secures €135 million in funding round
Experts urge EU to increase investment in photonics or risk falling behind China
Reality AI Explorer Tier offers free AI/ML development access
AEM introduces new generation of Automated Burn-In Systems
NPUs are emerging as the main rival to Nvidia’s AI dominance, says DAI Magister
Camtek receives a $20M order from a Tier-1 OSAT
Free samples of every STMicroelectronics NPI IC available from Anglia
NY CREATES and SEMI sign MoU
Major government investment to 'propel' Canada
QuickLogic announces $5.26 million contract award
ASNA and Athinia collaborate
Global sales forecast to reach record $109 billion in 2024
AMD to acquire Silo AI
Nanotronics unveils 'groundbreaking' Gen V AI Model
Aitomatic unveils SemiKong
Biden-Harris Administration reveals first CHIPS for America R&D facilities and selection processes
Collaboration to produce cutting-edge AI accelerator chips
Oxford Ionics breaks global quantum performance records
Adeia wins ECTC Award for paper on “Fine Pitch Die-to-Wafer Hybrid Bonding”
AEM introduces new generation of Automated Burn-In Systems
Sydney council forges vital semiconductor agreement
EV Group's EVG880 LayerRelease wins 2024 Best of West
Biden-Harris Administration to invest up to $1.6 billion
Cyient sets up subsidiary for semiconductor business
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: