+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Keysight Integrates PathWave with Samsung’s 28FDS Process Design Kit

Keysight Technologies has announced that PathWave Advanced Design System (ADS) and PathWave RFIC Design (GoldenGate) are integrated with the latest interoperable process design kit (iPDK) from Samsung for the 28FDS (28nm fully-depleted silicon-on-insulator) process technology. As a result, designers can jumpstart chip design work, reducing development time and costs.

Keysight’s PathWave is a software platform that enables agile and connected design and test. It accelerates product development by modernizing engineering workflows, connecting simulation and measurement data throughout the design, test, and manufacturing lifecycle.

Samsung’s 28FDS process technology combines high performance and low power consumption with responsiveness to power management design techniques and is showing promise for modern mobile and consumer multimedia chips. The new iPDK from Samsung enables designers to quickly create circuit designs and perform simulations.

“The integration of Samsung Foundry’s 28FDS technology for design and simulation with Keysight PathWave design solutions is the beginning of a new partnership between the two companies under Keysight’s Foundry Program,” said Punmark Ngangom, RFIC Foundry Program manager for Keysight Technologies. “Our mutual customers will be able to start their designs in PathWave ADS, or leverage the interoperability feature, to bring in designs from other EDA tools with Samsung’s 28FDS iPDK and do accurate circuit simulations and optimizations in PathWave ADS.”

DuPont to showcase materials innovation for EUV lithography
CEA-Leti develops novel architecture for Keyword-Spotting
Imec pioneers low-power UWB receiver chip
New eBook from Mouser and Analog Devices
Keysight joins U.S. Commerce Department’s AI Safety Institute Consortium
Greene Tweed names industry veteran Justine Franchina as COO
Arizona Commerce Authority allocates funding to NAU
SwissChips Initiative to boost Swiss chip industry
Five facilities in five years for India?
Brewer Science to present innovative materials and processes at SPIE Conference
VTT explores how to make communications smoother with quantum computing
SIA applauds over $5 billion in CHIPS R&D investments
ASMC 2024 to spotlight advanced innovations
Siemens acquires high-performance visual inspection company "Inspekto"
Optimising predictive maintenance
Industry poised for 2024 recovery
zeroRISC, Nuvoton and Winbond join forces
Infineon drives decarbonisation and digitalisation
ROHM introduces new SBDs
Imec launches Design Pathfinding Process Design Kit for N2 Node
High-speed line inspection at the IPC APEX EXPO 2024
Renesas to acquire PCB design software leader Altium
SK hynix unveils recycled materials roadmap
Supporting quantum workforce development
Ichor receives Supplier Excellence Award from Applied Materials
Empower Semiconductor showcases IVRs
Bruker acquires Nanophoton Corporation
Government backs Kioxia and Western Digital’s JV
Webinar focuses on Precision Electronics for Scientific Discovery
The challenge of decarbonizing the semiconductor industry and fulfilling chip demand
Toppan Photomask signs agreement with IBM
Korean AI chipmaker Rebellions closes $124M Series B fundraise
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: