+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

German President Steinmeier visits Infineon site in Malaysia

News

New exhaust air purification system will significantly improve Infineon's positive climate footprint.

German President Frank-Walter Steinmeier recently visited Infineon Technologies AG in Kulim, Malaysia, as part of his trip to Asia. The visit focused on Infineon's contribution to enabling the global energy transition with energy-saving semiconductor solutions, as well as by investing in solutions that further reduce the CO 2 footprint in its chip manufacturing.

Infineon is currently building a new plant for two billion euros that will focus on so-called compound semiconductors. These semiconductors are based on new materials like silicon carbide and gallium nitrite that enable further energy-efficiency increases. Energy-saving semiconductor solutions play a central role in the energy transition. Among other things, these solutions are used in wind turbines, solar power systems, e-vehicles and charging infrastructures. Kulim 3 will be ready for equipment in summer 2024 and will create 900 jobs. Infineon confirmed that construction work is on schedule.

During Steinmeier's visit, Infineon presented its investment in expanding the exhaust air purification system at the Kulim site. Avoiding CO 2 emissions is a clear priority for Infineon in implementing its climate strategy. Modern exhaust-air purification systems offer the greatest leverage in this regard. The upgrade in Kulim is expected to result in an approximately eight percent reduction of global direct site-related emissions (Scope 1) by the end of the 2023 fiscal year, compared to the previous year. A planned new exhaust-air purification system in Austin, USA, will lead to further savings.

The company has also set the goal of operating 100 percent of its plants in Malaysia with green electricity in the future and is in close exchange with local suppliers and the government to this end. The initiative will help further improve Infineon's positive climate contribution. Today, the company's energy-efficient solutions help save 33 times the amount of CO 2 emitted during their production.

"Infineon is fully aligned with the trends of decarbonization and digitalization," said C.S. Chua, President and Managing Director of Infineon Asia Pacific. "The growing demand for renewable energy, e-vehicles as well as energy-efficient applications will lead to a strong increase in the demand for power semiconductors. Our investments in Kulim and beyond are laying the foundation for being able to serve this growing need as well."

Laser focus on Glasgow
Kaman Measuring introduces ThreadChecker
SandBox Semiconductor adds hybrid metrology capabilities
Intel empowers developers to 'Bring AI Everywhere'
Fab renovation: A blue CHIPS investment
Aqua Membranes collaborates with Micron Technology
Brewer Science releases Impact Report 2023
UK semiconductor strategy: A patent attorney’s perspective
Wafer cleaning market to reach US$ 17.2 billion
Solvay signs partnership agreement with Shengjian
ACM cleaning platform targets chiplets industry
Vietnam's thriving semiconductor industry fuels economic resilience
GSA celebrates women's innovation
The need for geofencing to help improve semiconductor IP security
All roads lead to Arizona
Time to celebrate and accelerate diversity, equity and inclusion
Cadence completes acquisition of PHY IP assets from Rambus
Wales joins the European Semiconductor Regional Alliance
Magnachip targets EV market
Greene Tweed: When it can’t fail
Advanced Packaging market Size to reach $66.9 billion by 2032
Inventec and Renesas to develop PoC for automotive gateways
Renesas commences Sequans tender offer
Tower Semiconductor and InnoLight partner
Flanders Semiconductors - a new hub in the heart of Europe
Ambiq wins Demo of the Year Award
Advanced packaging market nears US$90 billion
Intel Foundry Services and Tower Semiconductor reach US foundry agreement
MediaTek develops first chip using TSMC's 3nm Process
Advanced X-ray technology for advanced packaging
New developments in underlayers and their role in advancing EUV lithography
Advanced SAM validates integrity of electrostatic chucks
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: