+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

ESD Alliance elects governing council

News

The Electronic System Design (ESD) Alliance, a SEMI Technology Community, has announced the election of its Governing Council for the 2023-2025 term. New to the Governing Council are Niels Faché, vice president and general manager at Keysight, and John Lee, general manager and vice president at Ansys.

LogoFaché and Lee join Governing Council members re-elected to a two-year term that runs through 2025:


Aart de Geus, chairman and CEO of Synopsys, Inc.

Anirudh Devgan, president and CEO of Cadence Design Systems

Niels Faché, vice president and general manager of Keysight

Aki Fujimura, CEO of D2S

Maheen Hamid, CFO and COO of Breker Verification Systems

John Kibarian, president and CEO of PDF Solutions, Inc.

John Lee,general manager and vice president of Ansys

Prakash Narain, president and CEO from Real Intent

Joe Sawicki, executive vice president of Siemens EDA

Bob Smith, executive director of the ESD Alliance

The Governing Council was elected by more than 60% of eligible member companies casting ballots during the voting period that ended April 28.


“It’s a pleasure to announce the results of our Governing Council election,” said Bob Smith, executive director of the ESD Alliance. “We welcome returning and new council members and thank outgoing members Dean Drako of IC Manage and industry veteran and former ESD Alliance chair Simon Segars for their many years of service to the ESD Alliance.”

5G chipset market worth $92.billion in 2030
KYZEN to showcase Multi-Process Power Module Cleaner
Fractilia has introduced FAME OPC for improved OPC modeling
Critical Manufacturing and RoviSys expand strategic alliance
Mouser Electronics and Analog Devices publish Collaborative eBooks
Infineon introduces Product Carbon Footprint data for customers
Alphawave Semi collaborates with Arm
VIS and NXP to establish fab JV
Infineon drives decarbonisation and digitalisation
The future of flexible technology?
CEA-Leti reports three-layer integration breakthrough
Nidec Advance Technology signs agreement with Synergie Cad Group
Flip-chip die bonder promises speed improvement
Raspberry Pi selects Hailo to enable advanced AI capabilities
Gartner forecasts worldwide AI chips revenue to grow 33% in 2024
Imec demonstrates die-to-wafer hybrid bonding with a Cu interconnect pad pitch of 2µm
Doubling throughput of layer transfer technology
Accelerating lab to fab
Advanced packaging in the spotlight
ASML and imec open joint High NA EUV Lithography Lab
TRI to drive AI innovation, working with NVIDIA
AlixLabs receives 2,5 MSEK grant for green semiconductor production
Applied Research Initiative advances Arizona’s semiconductor ecosystem
ERS electronic releases fully automatic Luminex machines with PhotoThermal debonding and wafer cleaning capability
Photonic Integrated Circuits benefit from AI data centre demand
SIA applauds CHIPS Act incentives for Polar Semiconductor
Mobix Labs completes RaGE Systems acquisition
ROHM and Nanjing SemiDrive Technology jointly develop reference design
PCIM Europe 2024: Extensive program provides new highlights
Emerson continues to invest in NI Test & Measurement products
Infineon reveals roadmap for energy-efficient power supply units in AI data centres
£3m grant for Glasgow chip research
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: