+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Arteris selected by BOS Semiconductors

The silicon-proven network-on-chip system IP and SoC integration technology enables the design of highly optimized, efficient and customized SoCs for the automotive sector.

BOS Semiconductors has licensed Arteris products for next-generation automotive SoCs. Arteris FlexNoC interconnect IP will be used as the communication backbone, coupled with the Magillem Gold Suite for SoC integration automation. Arteris products will help to ensure that BOS Semiconductors achieves optimized power, performance and reduced area for autonomous driving, HPC and gateway SoC automotive designs.

BOS Semiconductors is a global fabless company with deep roots in the semiconductor industry. They leverage best-of-breed IP from Arm to build advanced SoCs while focusing their expertise on system architecture for specialized designs that innovate the mobility experience, safety and comfort for drivers and passengers in the automotive market.

Arteris is a trusted partner and provider of proven IP and SoC connectivity that I’ve relied on in the past and continue to rely on today, Arteris FlexNoC IP and SoC automation products allowed us to minimize project risk and meet our overall performance, power targets, safety and efficiency goals amid demanding timelines.”

JaeHong Park, CEO of BOS Semiconductors, comments: “Arteris is a trusted partner and provider of proven IP and SoC connectivity that I’ve relied on in the past and continue to rely on today,” said JaeHong Park, CEO of BOS Semiconductors. “Arteris FlexNoC IP and SoC automation products allowed us to minimize project risk and meet our overall performance, power targets, safety and efficiency goals amid demanding timelines.”

FlexNoC IP with its Functional Safety option, and the Magillem Gold Suite for SoC integration are key technologies for developing advanced automotive SoCs. FlexNoC is a high-performance interconnect technology that seamlessly integrates multiple IP cores into a single SoC. The Functional Safety option is designed to detect and recover from potential failures in the system, ensuring the vehicle’s continuous operation. Finally, the Magillem Gold Suite is a comprehensive SoC integration toolset that provides efficient design and verification for chip creation.

“The automotive market with its growing use of autonomous SoC designs continues to drive the need for high-performance, energy-efficient, scalable and reconfigurable architectures,” said K. Charles Janac, president and CEO of Arteris. “We are pleased to leverage our automotive expertise and underlying connectivity technology so BOS Semiconductors can focus on delivering innovative and differentiated system designs.”

5G chipset market worth $92.billion in 2030
KYZEN to showcase Multi-Process Power Module Cleaner
Fractilia has introduced FAME OPC for improved OPC modeling
Critical Manufacturing and RoviSys expand strategic alliance
Mouser Electronics and Analog Devices publish Collaborative eBooks
Infineon introduces Product Carbon Footprint data for customers
Alphawave Semi collaborates with Arm
VIS and NXP to establish fab JV
Infineon drives decarbonisation and digitalisation
The future of flexible technology?
CEA-Leti reports three-layer integration breakthrough
Nidec Advance Technology signs agreement with Synergie Cad Group
Flip-chip die bonder promises speed improvement
Raspberry Pi selects Hailo to enable advanced AI capabilities
Gartner forecasts worldwide AI chips revenue to grow 33% in 2024
Imec demonstrates die-to-wafer hybrid bonding with a Cu interconnect pad pitch of 2µm
Doubling throughput of layer transfer technology
Accelerating lab to fab
Advanced packaging in the spotlight
ASML and imec open joint High NA EUV Lithography Lab
TRI to drive AI innovation, working with NVIDIA
AlixLabs receives 2,5 MSEK grant for green semiconductor production
Applied Research Initiative advances Arizona’s semiconductor ecosystem
ERS electronic releases fully automatic Luminex machines with PhotoThermal debonding and wafer cleaning capability
Photonic Integrated Circuits benefit from AI data centre demand
SIA applauds CHIPS Act incentives for Polar Semiconductor
Mobix Labs completes RaGE Systems acquisition
ROHM and Nanjing SemiDrive Technology jointly develop reference design
PCIM Europe 2024: Extensive program provides new highlights
Emerson continues to invest in NI Test & Measurement products
Infineon reveals roadmap for energy-efficient power supply units in AI data centres
£3m grant for Glasgow chip research
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: