+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Scientists advance development of laser-induced graphene (LIG)

News

Scientists show the practicality of turning laser-induced graphene into portable, flexible devices by making stacked supercapacitors.


Rice University scientists advanced their recent development of laser-induced graphene (LIG) by producing and testing stacked, three-dimensional supercapacitors, energy-storage devices that are important for portable, flexible electronics.

The Rice lab of chemist James Tour discovered last year that firing a laser at an inexpensive polymer burned off other elements and left a film of porous graphene, the much-studied atom-thick lattice of carbon. The researchers viewed the porous, conductive material as a perfect electrode for supercapacitors or electronic circuits.

An electron microscope image shows the cross section of laser-induced graphene burned into both sides of a polyimide substrate. The flexible material created at Rice University has the potential for use in electronics or for energy storage. Click on the image for a larger version. Courtesy of the Tour Group

An electron microscope image shows the cross section of laser-induced graphene burned into both sides of a polyimide substrate. The flexible material created at Rice University has the potential for use in electronics or for energy storage. Credit: Tour Group/Rice University

To prove it, members of the Tour group have since extended their work to make vertically aligned supercapacitors with laser-induced graphene on both sides of a polymer sheet. The sections are then stacked with solid electrolytes in between for a multilayer sandwich with multiple microsupercapacitors.

The flexible stacks show excellent energy-storage capacity and power potential and can be scaled up for commercial applications. LIG can be made in air at ambient temperature, perhaps in industrial quantities through roll-to-roll processes, Tour said.

The research was reported in Applied Materials and Interfaces.

Capacitors use an electrostatic charge to store energy they can release quickly, to a camera's flash, for example. Unlike chemical-based rechargeable batteries, capacitors charge fast and release all their energy at once when triggered. But chemical batteries hold far more energy. Supercapacitors combine useful qualities of both -- the fast charge/discharge of capacitors and high-energy capacity of batteries -- into one package.

LIG supercapacitors appear able to do all that with the added benefits of flexibility and scalability. The flexibility ensures they can easily conform to varied packages -- they can be rolled within a cylinder, for instance -- without giving up any of the device's performance.

 

 

A schematic shows the process developed by Rice University scientists to make vertical microsupercapacitors with laser-induced graphene. The flexible devices show potential for use in wearable and next-generation electronics. Credit: Tour Group/Rice University

"What we've made are comparable to microsupercapacitors being commercialized now, but our ability to put devices into a 3-D configuration allows us to pack a lot of them into a very small area," Tour said. "We simply stack them up.

"The other key is that we're doing this very simply. Nothing about the process requires a clean room. It's done on a commercial laser system, as found in routine machine shops, in the open air."

Ripples, wrinkles and sub-10-nanometer pores in the surface and atomic-level imperfections give LIG its ability to store a lot of energy. But the graphene retains its ability to move electrons quickly and gives it the quick charge-and-release characteristics of a supercapacitor. In testing, the researchers charged and discharged the devices for thousands of cycles with almost no loss of capacitance.

To show how well their supercapacitors scale up for applications, the researchers wired pairs of each variety of device in serial and parallel. As expected, they found the serial devices delivered double the working voltage, while the parallels doubled the discharge time at the same current density.

The vertical supercapacitors showed almost no change in electrical performance when flexed, even after 8,000 bending cycles.

Tour said that while thin-film lithium ion batteries are able to store more energy, LIG supercapacitors of the same size offer three times the performance in power (the speed at which energy flows). And the LIG devices can easily scale up for increased capacity.

"We've demonstrated that these are going to be excellent components of the flexible electronics that will soon be embedded in clothing and consumer goods," he said.


Sono-Tek to demonstrate SPT200 Photoresist Coating
Microelectronics industry education and workforce challenges explored
PEMTRON to spotlight semiconductor inspection solutions
OMNIVISION introduces 'smallest camera module'
Socionext joins the Global Semiconductor Alliance
Imec unveils CMOS-based 56Gb/s zero-IF D-band beamforming transmitter
Flip chip technology market to reach $45.22 billion in 2032
EV Group and Fraunhofer IZM-ASSID expand partnership
Company founder Ayhan Busch celebrates her 90th birthday
Moxa 5G expert to discuss Private 5G Networks
Nordson Test & Inspection to showcase Advanced Semiconductor Technologies
Greene Tweed extends global reach
5G chipset market worth $92.billion in 2030
KYZEN to showcase Multi-Process Power Module Cleaner
Fractilia has introduced FAME OPC for improved OPC modeling
Critical Manufacturing and RoviSys expand strategic alliance
Mouser Electronics and Analog Devices publish Collaborative eBooks
Infineon introduces Product Carbon Footprint data for customers
Alphawave Semi collaborates with Arm
VIS and NXP to establish fab JV
Infineon drives decarbonisation and digitalisation
The future of flexible technology?
CEA-Leti reports three-layer integration breakthrough
Nidec Advance Technology signs agreement with Synergie Cad Group
Flip-chip die bonder promises speed improvement
Raspberry Pi selects Hailo to enable advanced AI capabilities
Gartner forecasts worldwide AI chips revenue to grow 33% in 2024
Imec demonstrates die-to-wafer hybrid bonding with a Cu interconnect pad pitch of 2µm
Doubling throughput of layer transfer technology
Accelerating lab to fab
Advanced packaging in the spotlight
ASML and imec open joint High NA EUV Lithography Lab
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: