Deca,
a provider of advanced electronic interconnect technologies,
announced the signing of an agreement with ADTEC Engineering to join its
new AP Live
Network. The partnership allows ADTEC to embed an AP Connect module into its
new 2µm Laser Direct Imaging (LDI) system to natively process unique Adaptive
Patterning (AP) designs in real-time.

ADTEC will join
Deca's AP Live network, a growing supply chain ecosystem including original
equipment manufacturers (OEMs) and electronic design automation (EDA) vendors.
Deca's AP Connect software modules embed native support for real-time AP design
data into manufacturing equipment. AP Studio modules integrate the accompanying
custom design flows with leading EDA systems for layout and verification.

“AP
Live provides a comprehensive new capability to the backbone of the advanced
packaging process, allowing OEMs like ADTEC to partner with Deca to integrate
AP Connect functionality directly into their proven high-volume equipment,” said Tim Olson, founder and CEO of
Deca. “Deca is pleased to cooperate with ADTEC, the industry leader in high
density LDI, to bring a powerful new 2µm AP technology node to the advanced
packaging industry for chiplet integration.”

ADTEC
is planning to launch its cutting edge 2µm LDI system ‘DE-2' in the spring of
2021 for advanced packaging processes, including those used in fan-out
technology. Through native integration with Adaptive Patterning™, the
DE-2 will provide additional essential value to customers who require fine
patterning processes that deliver the highest yield.

“I
am pleased that ADTEC will cooperate with Deca,” said Keizo Tokuhiro, chairman
of ADTEC. “I strongly hope that the collaboration of both companies will
expedite technological progress in the industry and open up a bright future.”

About Adaptive Patterning

color:#1D1C1D;background:white">Deca's groundbreaking Adaptive Patterning
technology liberates designers and manufacturers from the constraints of fixed
photomasks, allowing the production flow to account for natural variation
without costly processes or design limitations. In contrast to previous techniques, AP
customizes each lithographic layer on a device-by-device basis in real time as
product moves through the manufacturing process, to ensure the highest possible
yield and the highest performance design rules with large via contacts on
ultra-fine interconnect pitch.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

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Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

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