Deca Announces Chiplet Advanced Packaging Partnership With ADTEC
a provider of advanced electronic interconnect technologies,
announced the signing of an agreement with ADTEC Engineering to join its
new AP Live
Network. The partnership allows ADTEC to embed an AP Connect module into its
new 2µm Laser Direct Imaging (LDI) system to natively process unique Adaptive
Patterning (AP) designs in real-time.
ADTEC will join
Deca's AP Live network, a growing supply chain ecosystem including original
equipment manufacturers (OEMs) and electronic design automation (EDA) vendors.
Deca's AP Connect software modules embed native support for real-time AP design
data into manufacturing equipment. AP Studio modules integrate the accompanying
custom design flows with leading EDA systems for layout and verification.
Live provides a comprehensive new capability to the backbone of the advanced
packaging process, allowing OEMs like ADTEC to partner with Deca to integrate
AP Connect functionality directly into their proven high-volume equipment,” said Tim Olson, founder and CEO of
Deca. “Deca is pleased to cooperate with ADTEC, the industry leader in high
density LDI, to bring a powerful new 2µm AP technology node to the advanced
packaging industry for chiplet integration.”
is planning to launch its cutting edge 2µm LDI system ‘DE-2' in the spring of
2021 for advanced packaging processes, including those used in fan-out
technology. Through native integration with Adaptive Patterning™, the
DE-2 will provide additional essential value to customers who require fine
patterning processes that deliver the highest yield.
am pleased that ADTEC will cooperate with Deca,” said Keizo Tokuhiro, chairman
of ADTEC. “I strongly hope that the collaboration of both companies will
expedite technological progress in the industry and open up a bright future.”
About Adaptive Patterning
color:#1D1C1D;background:white">Deca's groundbreaking Adaptive Patterning
technology liberates designers and manufacturers from the constraints of fixed
photomasks, allowing the production flow to account for natural variation
without costly processes or design limitations. In contrast to previous techniques, AP
customizes each lithographic layer on a device-by-device basis in real time as
product moves through the manufacturing process, to ensure the highest possible
yield and the highest performance design rules with large via contacts on
ultra-fine interconnect pitch.