+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
News Article

Infineon to lead European research project on Industry 5.0


Infineon Technologies AG is taking over coordination of the wide-scope European research project AIMS5.0 ("Artificial Intelligence in Manufacturing Leading to Sustainability and Industry 5.0").

Hardware and software-based Artificial Intelligence are to improve resource consumption in manufacturing and at the same time raise product quality. In addition, the objective is to improve resilience, optimize supply chains and time-to-market in order to boost the international competitive strength of Europe as a commercial location.

A budget of approximately 70 million euros makes AIMS5.0 one of Europe's major research projects. It is being funded under the European Union's Key Digital Technologies Joint Undertaking (KDT JU). 53 research and partners in industry from twelve countries are participating.

"Production processes in the sense of Industry 5.0 incorporate humans, the environment and the entire supply chain. The research project AIMS5.0 will make intensified use of Artificial Intelligence to achieve comprehensive improvements in all these aspects, thus increasing the sustainability, resilience and competitive strength of European manufacturing," says Rutger Wijburg, Chief Operating Officer at Infineon. "We at Infineon are committed to driving decarbonization and digitalization. We are therefore very pleased to take on leadership of AIMS5.0, where we will move Industry 5.0 ahead in alliance with excellent European partners."

The AIMS5.0 project consortium represents the entire chain, including producers, suppliers, specialists, research institutes and universities. In a variety of working groups they are examining 20 application cases from new fields and exchanging results on an interdisciplinary basis. A language model is to be developed which renders the widest possible variety of data intelligible for humans and computers in order to better analyze and forecast supply chains. Another application case is concerned with an interface between the human brain and the computer based on electroencephalography (EEG; measurement of brain waves). The interface is to control an exoskeleton as electromechanical support for humans in production operations. A third application case is developing an MLOps machine learning tool for the use of Artificial Intelligence in semiconductor manufacturing.

On the whole, AIMS5.0 is for the first time pursuing a joint approach to the application of AI and AI-based hardware across the widest possible variety of fields. This higher-level claim aligns the project with the tradition of its predecessor project Productive4.0. Also initiated by Infineon, Productive4.0 was outstanding and, as the largest European lighthouse project, paved the way to the digital transformation of European industry.

Over the course of three years, the research project AIMS5.0 will investigate decisive fundamentals for the next steps in the digital transformation of European industry. The kick-off event and official launch will take place at the Infineon Villach site on 23 May 2023.

The 53 partners in the AIMS5.0 research project:

AI Dig+ Solutions GmbH (DE), AIT Austrian Institute of Technology GmbH (AT), AITIA International Inc. (HU), Bayerische Motoren Werke Aktiengesellschaft (DE), Budapest University of Technology and Economics (HU), Cetto GmbH (DE), CISC Semiconductor GmbH (AT), DAC Spolka Akcyjna (PL), Elektronikas un datorzinatnu instituts (LV), Fabmatics GmbH (DE), FernUniversität in Hagen (DE), Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e. V. (DE), Gdansk University of Technology (PL), Goimek S.Coop (ES), Harokopio University (EL), Hochschule Stralsund (DE), Hochschule Zittau/Görlitz (DE), Husqvarna AB (SE), Ibermatica S.A (ES), Ideko S.COOP. (ES), Idryma Technologias Kai Erevnas (EL), Infineon Technologies AG (DE), Infineon Technologies Austria AG (AT), Infineon Technologies Dresden GmbH & Co. KG (DE), Institut für Integrierte Produktion Hannover gemeinnützige GmbH (DE), KAI - Kompetenzzentrum Automobil- und Industrieelektronik GmbH (AT), Lfoundry (IT), Luleå University of Technology (SE), NXP Semiconductors Netherlands BV (NL), Pfeiffer Vacuum SAS (FR), Philips Consumer Lifestyle BV (NL), PhytonIQ Technology (AT), Research Studios Austria Forschungsgesellschaft mbH (AT), Rijksuniversiteit Groningen (NL), SAVVY Data Systems S.L. (ES), Semaku BV (NL), Signify Netherlands BV (NL), Skandinaviska Enskilda Banken AB (SE), SmartUniversal (TR), Soraluce S. Coop (ES), Statwolf Data Science (IT), Stream Analyze (SE), SYSTEMA Systementwicklung Dipl.-Inf. Manfred Austen GmbH (DE), Technische Universitaet Dresden (DE), Technische Universiteit Eindhoven (NL), Thales Research and Technology (FR), TTTech Industrial Automation AG (AT), Tubitak Bilgem AI Institute (TR), Universität zu Lübeck (DE), Universidad Politécnica de Madrid (ES), Università degli Studi di Padova (IT), Virtual Vehicle Research GmbH (AT), Wirtschaftsuniversität Wien (AT)

UK semiconductor strategy: A patent attorney’s perspective
Wafer cleaning market to reach US$ 17.2 billion
Solvay signs partnership agreement with Shengjian
ACM cleaning platform targets chiplets industry
Vietnam's thriving semiconductor industry fuels economic resilience
GSA celebrates women's innovation
The need for geofencing to help improve semiconductor IP security
All roads lead to Arizona
Time to celebrate and accelerate diversity, equity and inclusion
Cadence completes acquisition of PHY IP assets from Rambus
Wales joins the European Semiconductor Regional Alliance
Magnachip targets EV market
Greene Tweed: When it can’t fail
Advanced Packaging market Size to reach $66.9 billion by 2032
Inventec and Renesas to develop PoC for automotive gateways
Renesas commences Sequans tender offer
Tower Semiconductor and InnoLight partner
Flanders Semiconductors - a new hub in the heart of Europe
Ambiq wins Demo of the Year Award
Advanced packaging market nears US$90 billion
Intel Foundry Services and Tower Semiconductor reach US foundry agreement
MediaTek develops first chip using TSMC's 3nm Process
Advanced X-ray technology for advanced packaging
New developments in underlayers and their role in advancing EUV lithography
Advanced SAM validates integrity of electrostatic chucks
Purdue establishes permanent presence next to NSWC Crane
Bolstering semiconductor ecosystem at Texas A&M University
Semiconductor industry sees revenue increase for the first time since 2021
Bosch completes TSI Semiconductors acquisition
Semiconductor grants for undergraduate women
Sustainability rises up the automotive agenda
Lumibird completes Prima acquisitions
Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: