Loading...
News Article

esmo group introduces Automated Final Test Manipulator

News

esmo group has launched ares auto setup, thought to be the world’s first final test manipulator capable of automated test head finding and positioning.

Final test manipulators play a pivotal role in semiconductor manufacturing. They are responsible for the precise positioning of test heads and boards to prepare the final testing phase.


Josef Weinberger, Head of Business Unit esmo semicon, said, “ares auto setup is an important step, not just for our company, but also for the industry at large. With ares auto setup, the world’s first automated final test manipulator, we are optimizing operational efficiency, and more importantly, shaping the future of semiconductor production processes.”


ares auto setup brings a paradigm shift to the semiconductor industry. Unlike other final test manipulators, ares auto setup allows for the automated manipulation of movement in x, y, z, and more rotational axes, enabling seamless and precise positioning of boards and test heads. This advancement simplifies the testing process, and eliminates the need for manual operation, saving time, resources, and costs. Additionally, the ares auto setup offers a range of linear and rotational motions to meet individual setup requirements.


The ares’ vision control and absolute value encoders ensure that each movement is precise and controlled, preventing any deviations or errors that might impact the integrity of the semiconductor components under test.


The automated setup feature reduces the time required for positioning and testing by eliminating the need for manual intervention. With a simple “push of a button”, ares auto setup swiftly and accurately repositions the components for the next phase of testing, allowing semiconductor manufacturers to stay ahead of the curve and meet tight production deadlines. ares auto setup’s automation also minimizes the need for manual labor, reducing the chances of human error and improving the overall quality and reliability of semiconductor products.


Other key features of ares auto setup includes:


Weight

Load capacity: up to 400 kg (882 lbs)

System weight: 650 kg (1432 lbs) unloaded

Standard motions

Horizontal (x-axis) 440 mm (17.4”)

Horizontal (y-axis) 200 mm (7.9”)

Vertical travel (z-axis) 365 mm (14.4”)

Left-Right-Compliance 10 mm (0.4”)

Tumble adjustment 3°

Rotation 180°

Twist 180°

Theta adjustment ± 0.3°

Silicon photonics: accelerating growth in the race for high-speed optical interconnects
CCD-in-CMOS technology enables ultra-fast burst mode imaging
2025 6G A look forward
Critical Manufacturing climbs Deloitte’s Technology Fast 50
Semiconductors: The most important thing you probably know the least about
Imec and partners unveil SWIR sensor with lead-free quantum dot photodiodes
Lattice introduces small and mid-range FPGA offerings
SEMI and SMT inspection solutions at NEPCON Japan 2025
Nordic Semiconductor and Kigen demonstrate Remote SIM Provisioning for Massive IoT
Spirent collaborates with Siemens
Quobly forges strategic collaboration with STMicroelectronics
New standards in pressure measurement systems for the semiconductor industry
IBM delivers optics breakthrough
Semiconductor equipment sales to reach $139 Billion in 2026
Marvell introduces 1.6 Tbps LPO Chipset
ACM research strengthens Atomic Layer Deposition portfolio
CEA-Leti demonstrates embedded FeRAM platform compatible with 22nm FD-SOI node
Lattice introduces small and mid-range FPGA offerings
Solace unlocks full potential of event-driven integration
Advantest to showcase latest test solutions at SEMICON Japan 2024
CEA-Leti device integrates light sensing and modulation
Nordic launches Thingy:91 X prototyping platform for cellular IoT and Wi-Fi locationing
Imec achieves seamless InP Chiplet integration on 300mm RF Silicon Interposer
High-precision SMU
Powering India’s energy future
China’s Nvidia probe puts global investors ‘on notice’
POET Technologies appoints new director
Imec demonstrates core building blocks of a scalable, CMOS-fab compatible superconducting digital technology
Imec proposes double-row CFET for the A7 technology node
ULVAC launches new deposition system
Beebolt and SEMI Announce Strategic Partnership to Drive Supplier Resilience and Agility
esmo group introduces Automated Final Test Manipulator
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: