+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Nordson Test & Inspection to unveil next-generation X-Ray Inspection System

News

Nordson TEST & INSPECTION will unveil the new Quadra 7 Pro Manual X-Ray Inspection (MXI) system at SEMICON China.

The Quadra 7 Pro MXI system provides superior 3D/2D manual inspection with higher resolution for back-end semiconductor applications. The new, advanced Onyx® detector technology inside provides lower noise for superior image clarity and faster frame rates. The latest Dual Mode Quadra NT4® tube provides maximum flexibility with two brightness and resolution modes, allowing users to dynamically switch between, depending on their application needs.

“We are excited to unveil our next-generation MXI system, powered by the latest generation QuadraNT4 tube and new Onyx detector,” said Perry Duffill, VP of Nordson TEST & INSPECTION. "We continue to advance our hardware and software technology to provide our customers superior, industry-leading solutions that address their challenging inspection needs – all to improve their yields, processes and productivity. The new Quadra 7 Pro is a leap ahead.”

Coupled with the advanced technology powering the Quadra 7 Pro, the new Revaluation™ software is designed for high-end semiconductor applications and enables an exceptional user experience with an intuitive interface, optimized workflow and enhanced functionality.

UK semiconductor strategy: A patent attorney’s perspective
Wafer cleaning market to reach US$ 17.2 billion
Solvay signs partnership agreement with Shengjian
ACM cleaning platform targets chiplets industry
Vietnam's thriving semiconductor industry fuels economic resilience
GSA celebrates women's innovation
The need for geofencing to help improve semiconductor IP security
All roads lead to Arizona
Time to celebrate and accelerate diversity, equity and inclusion
Cadence completes acquisition of PHY IP assets from Rambus
Wales joins the European Semiconductor Regional Alliance
Magnachip targets EV market
Greene Tweed: When it can’t fail
Advanced Packaging market Size to reach $66.9 billion by 2032
Inventec and Renesas to develop PoC for automotive gateways
Renesas commences Sequans tender offer
Tower Semiconductor and InnoLight partner
Flanders Semiconductors - a new hub in the heart of Europe
Ambiq wins Demo of the Year Award
Advanced packaging market nears US$90 billion
Intel Foundry Services and Tower Semiconductor reach US foundry agreement
MediaTek develops first chip using TSMC's 3nm Process
Advanced X-ray technology for advanced packaging
New developments in underlayers and their role in advancing EUV lithography
Advanced SAM validates integrity of electrostatic chucks
Purdue establishes permanent presence next to NSWC Crane
Bolstering semiconductor ecosystem at Texas A&M University
Semiconductor industry sees revenue increase for the first time since 2021
Bosch completes TSI Semiconductors acquisition
Semiconductor grants for undergraduate women
Sustainability rises up the automotive agenda
Lumibird completes Prima acquisitions
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: