+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Renesas completes Panthronics acquisition

News

Renesas Electronics Corporation has acquired Panthronics AG, a fabless semiconductor company specializing in high-performance wireless products.

The acquisition was completed as of June 2, 2023 JST, June 1, 2023 CEST, following required regulatory approval. Renesas also announced 13 “Winning Combination” solution designs that combine Renesas’ products with Panthronics’ unique Near-Field Communication (NFC) technology, showcasing the continued expansion of Renesas’ portfolio, specifically in the connectivity space.

“We are excited to welcome the Panthronics team to Renesas, and announce 13 Winning Combinations showcasing the technological synergy between the companies on the same day,” said Sailesh Chittipeddi, Executive Vice President & General Manager of the Embedded Processing, Digital Power and Signal Chain Solutions Group. “These Winning Combinations unite Renesas’ broad range of embedded processing, power, connectivity, and analog portfolios with Panthronics’ NFC technology, providing customers with turnkey NFC solutions.”

NFC is now widely used in our daily life, and its market is expected to grow exponentially for both industrial and automotive use cases. Headquartered in Graz, Austria, Panthronics has been offering advanced NFC chipsets and software that are easy to apply, small-in-size, and highly efficient for payment, IoT, asset tracking and wireless charging.

The acquisition provides Renesas with in-house capability to instantly capture growing market opportunities for NFC. With Panthronics’ NFC expertise and skilled engineering talent, Renesas will be able to offer customers a compelling breadth of connectivity solutions in growing areas spanning fintech, IoT, and automotive spheres.

To immediately demonstrate the companies’ technological advantages, Renesas announced 13 Winning Combinations integrating Renesas’ embedded processing, power, connectivity, and analog portfolios with Panthronics’ unique NFC technology. These market-ready reference designs allow customers to instantly start developing NFC systems with minimal cost and time. Panthronics’ devices are also part of Renesas Quick-Connect IoT, a platform of standardized hardware, and the Quick-Connect Studio which enables the “drag and drop” feature in system design to quickly and easily add required functions and features.

13 Winning Combinations featuring Renesas and Panthronics products:

• Smart NFC Access Control System

• Mobile Point of Sale (POS) Terminal

• High-Performance Electric Vehicle (EV) Charger Wall Box

• Metered Electric Vehicle (EV) Charging Station

• 1-Phase Power Meter

• Green 3-Phase Smart Energy Meter

• Single Board Computer

• High-Performance Human Machine Interface (HMI) System

• HMI Solution for Appliances

• IoT Communications Gateway Hub

• Smart Lock with Super-Low Power Wi-Fi and Bluetooth LE

• Personal Safety Tracker

• Printer Control Panel with NFC Authentication

UK semiconductor strategy: A patent attorney’s perspective
Wafer cleaning market to reach US$ 17.2 billion
Solvay signs partnership agreement with Shengjian
ACM cleaning platform targets chiplets industry
Vietnam's thriving semiconductor industry fuels economic resilience
GSA celebrates women's innovation
The need for geofencing to help improve semiconductor IP security
All roads lead to Arizona
Time to celebrate and accelerate diversity, equity and inclusion
Cadence completes acquisition of PHY IP assets from Rambus
Wales joins the European Semiconductor Regional Alliance
Magnachip targets EV market
Greene Tweed: When it can’t fail
Advanced Packaging market Size to reach $66.9 billion by 2032
Inventec and Renesas to develop PoC for automotive gateways
Renesas commences Sequans tender offer
Tower Semiconductor and InnoLight partner
Flanders Semiconductors - a new hub in the heart of Europe
Ambiq wins Demo of the Year Award
Advanced packaging market nears US$90 billion
Intel Foundry Services and Tower Semiconductor reach US foundry agreement
MediaTek develops first chip using TSMC's 3nm Process
Advanced X-ray technology for advanced packaging
New developments in underlayers and their role in advancing EUV lithography
Advanced SAM validates integrity of electrostatic chucks
Purdue establishes permanent presence next to NSWC Crane
Bolstering semiconductor ecosystem at Texas A&M University
Semiconductor industry sees revenue increase for the first time since 2021
Bosch completes TSI Semiconductors acquisition
Semiconductor grants for undergraduate women
Sustainability rises up the automotive agenda
Lumibird completes Prima acquisitions
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: