Loading...
News Article

Greene Tweed introduces Canted Coil MSE Sealing solution

News

Reduces power loss and improves precision movement without sacrificing leakage control or durability.

Greene Tweed introduces the new Canted Coil MSE® (metal spring energized) sealing solution, designed to further reduce power loss and improve precision movement without sacrificing leakage control or durability. The seals offer broad chemical compatibility and resistance to extreme temperatures, pressure, and wear.

Greene Tweed devoted two years of design development and in-house testing in an attempt to lead the industry in not only friction reduction but also sealing in the most challenging low temperature applications. Benchmark testing against some of the top performing spring energized seals highlighted the compromise in performance at extreme temperatures. Low friction at higher temperatures resulted in high leakage at low temperatures. Prioritizing leakage control at low temperature resulted in higher friction. Greene Tweed’s new canted coil demonstrated a friction improvement of up to 61% across a wide temperature range while improving leakage control up to 74% especially at lower temperatures. All of this makes the new Canted Coil MSE ideal for a variety of smaller diameter applications, including precise robotic movement, precise valve controls, hydraulic actuation, medical dispensing, and semiconductor production.

Another benefit to the Canted Coil design is even as the sealing material wears away, the sealing and friction performance remains consistent.

Silicon photonics: accelerating growth in the race for high-speed optical interconnects
CCD-in-CMOS technology enables ultra-fast burst mode imaging
2025 6G A look forward
Critical Manufacturing climbs Deloitte’s Technology Fast 50
Semiconductors: The most important thing you probably know the least about
Imec and partners unveil SWIR sensor with lead-free quantum dot photodiodes
Lattice introduces small and mid-range FPGA offerings
SEMI and SMT inspection solutions at NEPCON Japan 2025
Nordic Semiconductor and Kigen demonstrate Remote SIM Provisioning for Massive IoT
Spirent collaborates with Siemens
Quobly forges strategic collaboration with STMicroelectronics
New standards in pressure measurement systems for the semiconductor industry
IBM delivers optics breakthrough
Semiconductor equipment sales to reach $139 Billion in 2026
Marvell introduces 1.6 Tbps LPO Chipset
ACM research strengthens Atomic Layer Deposition portfolio
CEA-Leti demonstrates embedded FeRAM platform compatible with 22nm FD-SOI node
Lattice introduces small and mid-range FPGA offerings
Solace unlocks full potential of event-driven integration
Advantest to showcase latest test solutions at SEMICON Japan 2024
CEA-Leti device integrates light sensing and modulation
Nordic launches Thingy:91 X prototyping platform for cellular IoT and Wi-Fi locationing
Imec achieves seamless InP Chiplet integration on 300mm RF Silicon Interposer
High-precision SMU
Powering India’s energy future
China’s Nvidia probe puts global investors ‘on notice’
POET Technologies appoints new director
Imec demonstrates core building blocks of a scalable, CMOS-fab compatible superconducting digital technology
Imec proposes double-row CFET for the A7 technology node
ULVAC launches new deposition system
Beebolt and SEMI Announce Strategic Partnership to Drive Supplier Resilience and Agility
esmo group introduces Automated Final Test Manipulator
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: