Loading...
News Article

Meta teams up with Tyndall

News

Tyndall National Institute, based at University College Cork, Ireland, has announced the establishment of the Meta Industrial Chair in Semiconductor Technologies underpinning a multi-year research programme.

Meta has agreed to a four-year programme of research led by Tyndall’s Professor Paul Hurley, recently appointed as Meta’s Industrial Chair in Semiconductor Technologies at Tyndall and the School of Chemistry at UCC.

The announcement was attended by Tánaiste, and Minister for Foreign Affairs & Minister for Defence Micheál Martin at UCC this week.

This unique appointment demonstrates Meta’s world-class research efforts in the core technologies underpinning the broad adoption of Augmented Reality (AR) platforms, and the strategic importance of its Irish research teams collaborating with Tyndall in Cork. Speaking in UCC,

Tánaiste Martin said, “I want to warmly welcome this significant investment by Meta in the work carried out in UCC and Tyndall. Such a partnership involving a world-leader like Meta is a huge vote of confidence in the leading research taking place here in Cork.”

Professor Hurley will lead a multi-disciplinary research team, including the appointment of a cohort of Tyndall PhD students, to help advance the state of AR technology alongside Meta.

Speaking about this agreement, Pádraig Hughes, Head of Reality Labs at Meta in Cork said, “We’re delighted with the appointment of Professor Paul Hurley as Meta’s Chair to advance research in miniature light display technologies for Augmented Reality. It is a testament to the calibre of Irish academic research, and in particular the research that Paul is leading at the Tyndall National Institute.”

Professor Paul Hurley added, “The optoelectronic efficiency of ultra-scaled devices such as micro LEDs is dominated by surfaces and interfaces. The goal of this research engagement with Meta is to investigate heterogeneous systems and determine their impact on efficiency, further informing critical technology adoption in future products.”

Professor William Scanlon, CEO, Tyndall National Institute commented, “Meta’s work with Tyndall will further develop our semiconductor research programme and hopefully lead to new advances in display technologies and product innovations for the AR sector. The work further strengthens Ireland’s strategic importance to Meta and in particular, Tyndall’s research excellence in semiconductors and photonics.”

Professor John O’Halloran, President, UCC concluded, “I want to congratulate Professor Hurley on his appointment, and Tyndall and Meta on this exciting research endeavour. This collaboration is testament to the world-leading research taking place at both Tyndall and UCC, where we place an emphasis on translating the outcomes of our exploration into solutions for the real-world challenges facing us all.”

Silicon photonics: accelerating growth in the race for high-speed optical interconnects
CCD-in-CMOS technology enables ultra-fast burst mode imaging
2025 6G A look forward
Critical Manufacturing climbs Deloitte’s Technology Fast 50
Semiconductors: The most important thing you probably know the least about
Imec and partners unveil SWIR sensor with lead-free quantum dot photodiodes
Lattice introduces small and mid-range FPGA offerings
SEMI and SMT inspection solutions at NEPCON Japan 2025
Nordic Semiconductor and Kigen demonstrate Remote SIM Provisioning for Massive IoT
Spirent collaborates with Siemens
Quobly forges strategic collaboration with STMicroelectronics
New standards in pressure measurement systems for the semiconductor industry
IBM delivers optics breakthrough
Semiconductor equipment sales to reach $139 Billion in 2026
Marvell introduces 1.6 Tbps LPO Chipset
ACM research strengthens Atomic Layer Deposition portfolio
CEA-Leti demonstrates embedded FeRAM platform compatible with 22nm FD-SOI node
Lattice introduces small and mid-range FPGA offerings
Solace unlocks full potential of event-driven integration
Advantest to showcase latest test solutions at SEMICON Japan 2024
CEA-Leti device integrates light sensing and modulation
Nordic launches Thingy:91 X prototyping platform for cellular IoT and Wi-Fi locationing
Imec achieves seamless InP Chiplet integration on 300mm RF Silicon Interposer
High-precision SMU
Powering India’s energy future
China’s Nvidia probe puts global investors ‘on notice’
POET Technologies appoints new director
Imec demonstrates core building blocks of a scalable, CMOS-fab compatible superconducting digital technology
Imec proposes double-row CFET for the A7 technology node
ULVAC launches new deposition system
Beebolt and SEMI Announce Strategic Partnership to Drive Supplier Resilience and Agility
esmo group introduces Automated Final Test Manipulator
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: