Greene Tweed highlights advanced solutions
Visit Booth 429 at SEMICON WEST 2023 to see innovative, high-performance elastomer and composite/thermoplastic.
Greene Tweed will be showcasing its advanced elastomer and composite/thermoplastic solutions for demanding semiconductor fabrication applications at SEMICON WEST 2023, from July 11-13, 2023 at the Moscone Center, San Francisco, CA, Booth 429.
Greene Tweed’s advanced elastomer seals and thermoplastic components are found throughout a broad range of mission-critical equipment in key process areas of the world’s semiconductor fabs, including etch, deposition, aqueous, and electro-chemical (electroplating).
“Greene Tweed takes pride in our material science innovation and our custom engineered solutions for the rapidly evolving semiconductor industry,” says Magen Buterbaugh, President and CEO, Greene Tweed. “For more than two decades the leading semiconductor fabs, foundries and OEMs have trusted our advanced materials and precision engineering for consistent and dependable performance in applications subjected to extremely harsh chemicals and high temperatures.”
The products on display at SEMICON WEST will include Chemraz® G57 sealing solutions, specifically developed to meet the demands of aggressive dry plasma systems. The unique formulation of Chemraz® G57 perfluoroelastomer provides enhanced plasma resistance and minimal contamination, resulting in less downtime and higher wafer processing yields. Recommended for both static and dynamic oxide etch wafer processing applications, Chemraz® G57 remains stable at service temperatures up to 572°F / 300°C.
Also on display will be ONX® 600, a high-performance, low-cost composite used in precision engineered components for semiconductor manufacturing. ONX® 600 provides a resilient wafer cleaning solution able to withstand corrosive chemicals at high temperatures and pressures.
