Loading...
News Article

Fully qualified eFlash

News

Faraday Technology Corporation has announced the successful qualification of Faraday’s Ariel IoT SoC with UMC’s 40nm ultra-low-power (40ULP) process.

Exclusively offering the SONOS eFlash solution on UMC’s 40ULP, Faraday aims at AIoT, MCU, and smart grid projects that necessitate superior performance and low-power consumption.

Faraday’s Ariel SoC, implemented with SONOS eFlash macro, has successfully passed the reliability test with HTOL (High Temperature Operating Life Latent Failure Rate) of 1000 hours at 125°C, characterization of data retention at 125°C, and more than 100k cycles of endurance test. Through the extensive testing on real silicon under rigorous conditions, Infineon’s SONOS eFlash has been confirmed that it is a qualified eNVM solution on UMC’s 40ULP.

In a strategic collaboration with UMC and Infineon, Faraday has rolled out the 40ULP SONOS eFlash ASIC turnkey service, which supports the SONOS subsystem IP, wafer manufacturing, chip packaging and testing; the SONOS subsystem IP includes eFlash controller, eFlash macro IP, complete BIST on eFlash, and additional cache functions for easy data access and control. Customers can simplify integration efforts for SONOS eFlash and proceed with mass production by utilizing the cost-effective eNVM solution on UMC 40ULP.

“The SONOS eFlash is fully compatible with UMC’s 40ULP logic process,” said Flash Lin, COO of Faraday. “This compatibility obviates the need for extra efforts in IP porting and requires only a few additional masks for manufacturing, thereby reducing both cost and manufacturing cycle time for customers.”

“SONOS eFlash has been market-proven in various applications on UMC’s 40ULP process,” said Vineet Agrawal, Sr. Director of Infineon Technologies LLC Memory Solutions. “Faraday’s comprehensive SONOS eFlash solution enables customers to effortlessly meet cost, power, and performance requirements for SoC designs across a wide range of IoT products and applications.”

“Faraday's successful verification of the UMC 40ULP SONOS eFlash process with their Ariel IoT ASIC marks a significant step towards powering AIoT related projects with efficient low power consumption,” said Yau Kae Sheu, UMC’s Associate Vice President of Technology Development. “Our collaboration has resulted in a comprehensive turnkey service that simplifies the adoption of eFlash memory technology for various applications.”

Silicon photonics: accelerating growth in the race for high-speed optical interconnects
CCD-in-CMOS technology enables ultra-fast burst mode imaging
2025 6G A look forward
Critical Manufacturing climbs Deloitte’s Technology Fast 50
Semiconductors: The most important thing you probably know the least about
Imec and partners unveil SWIR sensor with lead-free quantum dot photodiodes
Lattice introduces small and mid-range FPGA offerings
SEMI and SMT inspection solutions at NEPCON Japan 2025
Nordic Semiconductor and Kigen demonstrate Remote SIM Provisioning for Massive IoT
Spirent collaborates with Siemens
Quobly forges strategic collaboration with STMicroelectronics
New standards in pressure measurement systems for the semiconductor industry
IBM delivers optics breakthrough
Semiconductor equipment sales to reach $139 Billion in 2026
Marvell introduces 1.6 Tbps LPO Chipset
ACM research strengthens Atomic Layer Deposition portfolio
CEA-Leti demonstrates embedded FeRAM platform compatible with 22nm FD-SOI node
Lattice introduces small and mid-range FPGA offerings
Solace unlocks full potential of event-driven integration
Advantest to showcase latest test solutions at SEMICON Japan 2024
CEA-Leti device integrates light sensing and modulation
Nordic launches Thingy:91 X prototyping platform for cellular IoT and Wi-Fi locationing
Imec achieves seamless InP Chiplet integration on 300mm RF Silicon Interposer
High-precision SMU
Powering India’s energy future
China’s Nvidia probe puts global investors ‘on notice’
POET Technologies appoints new director
Imec demonstrates core building blocks of a scalable, CMOS-fab compatible superconducting digital technology
Imec proposes double-row CFET for the A7 technology node
ULVAC launches new deposition system
Beebolt and SEMI Announce Strategic Partnership to Drive Supplier Resilience and Agility
esmo group introduces Automated Final Test Manipulator
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: