Loading...
News Article

Semiconductor grants for undergraduate women

News

Last Mile Education Fund announced is now accepting applications for the Applied Materials Momentum Fund for undergraduate women in engineering. 

Today, The fund provides rapid access to gap funding during the last mile of a student's program in an effort to ensure that undergraduate women aiming for careers in the semiconductor industry have the resources to persist to graduation and into the workforce.  

“Striving students in their ‘last mile’ represent a significant untapped pool of technical talent poised to join the workforce,” said Ruthe Farmer, Founder and CEO of the Last Mile Education Fund. “With the semiconductor industry anticipating 200,000 new jobs annually, it is more important than ever to invest in high-potential women students to fill these roles.” 

The Applied Materials Momentum Fund is focused on equipping female students with the support required to bridge the gap between education and industry. The three-year initiative will provide over $1 million in targeted assistance to undergraduates pursuing engineering majors, including but not limited to electrical, computer, mechanical, hardware, physics and electronics engineering. The fund addresses financial obstacles that most scholarships exclude such as food or housing, transportation, and medical or dental expenses.

In addition to providing grants, the Applied Materials Momentum Fund will offer access to hands-on experience and valuable networking connections through internship opportunities and career development experiences at Applied Materials.

“We are pleased to team with Last Mile Education Fund to help more women launch successful careers as innovators in semiconductors,” said Gary Dickerson, President and CEO of Applied Materials.”

Qualified students can access funds on a rolling basis to support their educational progress and overcome unexpected financial obstacles. This opportunity is available to undergraduate women students in engineering from any school across the U.S. who meet the fund’s eligibility criteria.

Each application is considered individually and approved grantees receive customized funding to facilitate their success. Students can apply now at https://www.lastmile-ed.org/applied-materials 

Faculty or community members who would like to recommend eligible students for this fund can nominate them at https://www.lastmile-ed.org/refer-a-student

Silicon photonics: accelerating growth in the race for high-speed optical interconnects
CCD-in-CMOS technology enables ultra-fast burst mode imaging
2025 6G A look forward
Critical Manufacturing climbs Deloitte’s Technology Fast 50
Semiconductors: The most important thing you probably know the least about
Imec and partners unveil SWIR sensor with lead-free quantum dot photodiodes
Lattice introduces small and mid-range FPGA offerings
SEMI and SMT inspection solutions at NEPCON Japan 2025
Nordic Semiconductor and Kigen demonstrate Remote SIM Provisioning for Massive IoT
Spirent collaborates with Siemens
Quobly forges strategic collaboration with STMicroelectronics
New standards in pressure measurement systems for the semiconductor industry
IBM delivers optics breakthrough
Semiconductor equipment sales to reach $139 Billion in 2026
Marvell introduces 1.6 Tbps LPO Chipset
ACM research strengthens Atomic Layer Deposition portfolio
CEA-Leti demonstrates embedded FeRAM platform compatible with 22nm FD-SOI node
Lattice introduces small and mid-range FPGA offerings
Solace unlocks full potential of event-driven integration
Advantest to showcase latest test solutions at SEMICON Japan 2024
CEA-Leti device integrates light sensing and modulation
Nordic launches Thingy:91 X prototyping platform for cellular IoT and Wi-Fi locationing
Imec achieves seamless InP Chiplet integration on 300mm RF Silicon Interposer
High-precision SMU
Powering India’s energy future
China’s Nvidia probe puts global investors ‘on notice’
POET Technologies appoints new director
Imec demonstrates core building blocks of a scalable, CMOS-fab compatible superconducting digital technology
Imec proposes double-row CFET for the A7 technology node
ULVAC launches new deposition system
Beebolt and SEMI Announce Strategic Partnership to Drive Supplier Resilience and Agility
esmo group introduces Automated Final Test Manipulator
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: