+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Inventec and Renesas to develop PoC for automotive gateways

News

Inventec and Renesas Electronics have agreed to jointly design automotive-grade gateway solutions for the rapidly-growing electric vehicle (EV) market.

Targeting Tier-1 automotive suppliers and OEMs, the companies will develop a Proof of Concept (PoC) for connected gateways based on the industry-leading R-Car system-on-chip (SoC) from Renesas.

Under the terms of the agreement, Renesas will provide Inventec its latest offering of R-Car SoCs, analog, and power products, along with engineering support to assist Inventec in developing a PoC for next-generation in-vehicle connected gateway systems. The two companies will regularly share product development roadmaps, market insights and specifications. The first PoC will integrate cybersecurity and over-the-air (OTA) features for connected gateway applications and is expected to be available by Inventec in Q2 of 2024.

“We are delighted to have Inventec as a partner to build a faster and more secure gateway solution for EVs,” said Takeshi Fuse, Head of Function Unit and Business Development for the High Performance Computing, Analog and Power Solutions Group at Renesas. “As Tier1s and car manufacturers increasingly invest in automotive electrification, we are uniquely positioned to build a working design that addresses the complex demands of today’s automotive industry.”

“We have years of experience serving the PC, server and mobile phone markets and meeting the performance and reliability requirements of our customers,” said Sam Yeh, Chairman of Inventec. “The integration of our technology with Renesas’ field-proven R-Car SoC platform will enable us to reach a new base of EV customers in search of advanced intelligent automotive solutions around the world.”

The development of the PoC for automotive gateways reflects a transformational shift toward new E/E (electrical and electronics) architectures in the automotive industry. Automotive system developers need to integrate complex networks of electronic control units (ECUs) into their vehicles and enable software to receive OTA updates securely. The new PoC will not only drive innovation in vehicle development, but also create new possibilities for emerging vehicle manufacturers worldwide to take part in the rapidly expanding EV market.

The Renesas R-Car is a high-performance, scalable compute platform that addresses a wide range of automotive applications, such as Automated Driving (AD), ADAS, connected gateways, in-vehicle infotainment systems, cockpits, and dashboards. In the future, the two companies plan to collaborate not only in connected gateways, but also in a wide range of in-vehicle applications such as vehicle computers, and battery management systems.

Tektronix and EA Elektro-Automatik offer expanded power portfolio
83% of supply chains can’t respond to disruptions in 24 hours
CMC Microsystems and ventureLAB sign MoU
Renesas introduces FemtoClock 3 timing solution
Mycronic receives order for SLX mask writer
Rapidus reveals US subsidiary and opens Silicon Valley office
Infineon introduces news MOTIX motor gate driver IC
Brewer Science unveils Smart Warehouse Monitor System
Symposium to showcase breakthroughs in microelectronics
CHIPS for America promotes over $50 million funding opportunity
SEMI University launches in-person courses
Samsung Electronics to establish Texan semiconductor ecosystem
Semiconductor chips drive innovation in AI and industries
Semiconductor equipment sales slip to $106.3 billion
Mouser Electronics receives 2023 Global Best Service Distributor of the Year Award from Diodes Incorporated
Quantum processor testing and measurement facilities up and running
Semiconductor Research Corporation announces 2024 call for research
Trend report unveils the future of circular electronics
PCIM Europe 2024: highlights and new records
PI contributes to technology node development
QP Technologies achieves ANSI/ESD S20.20 Certification
Renesas commences operations of Kofu Factory
TRI wins three Innovation Awards
Tektronix and recently acquired EA Elektro-Automatik offer expanded power portfolio
NEDO approves Rapidus’ FY2024 Plan and Budget
SK hynix signs Advanced Chip Packaging agreement
Renesas expands Quick Connect Studio
Infineon and Amkor deepen partnership
AP&S establishes site in the USA
Dracula Technologies selected by STMicroelectronics
RAIN RFID data to transform corporate sustainability initiatives
Integrated AMR replaces reed switches and hall effect sensors
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: