Loading...
News Article

Amkor inaugurates latest factory in Vietnam

News

The grand opening of our newest factory in Bac Ninh, Vietnam, was unveiled to Amkor executives, industry leaders, government officials and the press during a recent formal ribbon-cutting ceremony.

The $1.6 billion chip factory will become Amkor’s most advanced facility, delivering next-generation semiconductor packaging capabilities. The facility occupies a substantial 57-acre expanse within the Yen Phong 2C Industrial Park, and it will feature 200,000 square meters of cleanroom space.

Beginning with Advanced System in Package (SiP) and memory production, the factory will offer turnkey solutions—from design to electrical test—to the world’s leading semiconductor and electronic manufacturing companies.

“This state-of-the-art factory in Vietnam will help Amkor provide an unrivaled geographic footprint to our customers, supporting global but also enabling regional supply chains. It’s the kind of secure and reliable supply chain our customers need—in communications, automotive, high-performance computing, and other key industries,” said Giel Rutten, Amkor’s president and chief executive officer. “A large and skilled workforce, a strategic location, and support from government authorities made it an ideal location for Amkor’s continued growth. We are proud of what we’ve accomplished together with Vietnam and look forward to a long and mutually beneficial relationship.”

Silicon photonics: accelerating growth in the race for high-speed optical interconnects
CCD-in-CMOS technology enables ultra-fast burst mode imaging
2025 6G A look forward
Critical Manufacturing climbs Deloitte’s Technology Fast 50
Semiconductors: The most important thing you probably know the least about
Imec and partners unveil SWIR sensor with lead-free quantum dot photodiodes
Lattice introduces small and mid-range FPGA offerings
SEMI and SMT inspection solutions at NEPCON Japan 2025
Nordic Semiconductor and Kigen demonstrate Remote SIM Provisioning for Massive IoT
Spirent collaborates with Siemens
Quobly forges strategic collaboration with STMicroelectronics
New standards in pressure measurement systems for the semiconductor industry
IBM delivers optics breakthrough
Semiconductor equipment sales to reach $139 Billion in 2026
Marvell introduces 1.6 Tbps LPO Chipset
ACM research strengthens Atomic Layer Deposition portfolio
CEA-Leti demonstrates embedded FeRAM platform compatible with 22nm FD-SOI node
Lattice introduces small and mid-range FPGA offerings
Solace unlocks full potential of event-driven integration
Advantest to showcase latest test solutions at SEMICON Japan 2024
CEA-Leti device integrates light sensing and modulation
Nordic launches Thingy:91 X prototyping platform for cellular IoT and Wi-Fi locationing
Imec achieves seamless InP Chiplet integration on 300mm RF Silicon Interposer
High-precision SMU
Powering India’s energy future
China’s Nvidia probe puts global investors ‘on notice’
POET Technologies appoints new director
Imec demonstrates core building blocks of a scalable, CMOS-fab compatible superconducting digital technology
Imec proposes double-row CFET for the A7 technology node
ULVAC launches new deposition system
Beebolt and SEMI Announce Strategic Partnership to Drive Supplier Resilience and Agility
esmo group introduces Automated Final Test Manipulator
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: