+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
News Article

Socionext begins development of SoCs for Advanced ADAS and AD


Socionext is developing custom SoCs for advanced ADAS (Advanced Driver Assistance Systems) and AD (Autonomous Driving) using N3A, TSMC's latest 3nm automotive process technology. Target production of the SoCs will be in 2026.

TSMC’s 3nm technology is said to enable high volume production with significant improvements in power, performance, and area (PPA) when compared to previous technology nodes. TSMC’s N3E process offers up to 18% speed improvement at the same power, or 32% power reduction at the same speed, with up to 60% increase in logic density compared to N5. These PPA improvements are a key ingredient for future EV and vehicle deployments, where computing and workload requirements for next generation ADAS and AD applications often compete with the need for longer battery life and driving range.

The SoCs being developed are designed specifically for advanced driving assistance systems and autonomous driving applications, achieving exceptional performance and low-power consumption. By combining TSMC’s N3A process technology with Socionext’s experience to support ISO26262 functional safety product development, AEC-Q100 and IATF-16949 automotive quality and reliability requirements, Socionext is addressing the performance and safety demands of the rapidly evolving automotive electronic systems required by Automotive OEMs.

"We are excited to announce that we are continuing our history of adopting TSMC's leading-edge process technologies for automotive chip development" said Hisato Yoshida, Corporate Executive Vice President and the Head of Global Development Group at Socionext. “As the advanced ADAS and AD segment continues to grow, our customers are investing in custom SoC solutions to provide product differentiation and optimization of their hardware compute and software platforms. With customers’ requirements for high levels of integration with multi-core CPU clusters, AI acceleration, image and video processing, high-speed interfaces, as well as security and functional safety support, Socionext’s experience enables our customers to deliver next-generation automotive platforms. TSMC is a key silicon manufacturing partner for Socionext, not only for automotive developments, but for a wide range of applications ranging from consumer and industrial to datacenter and networking"

“Socionext has been an early adopter of TSMC’s leading-edge technologies for automotive applications,” said Dr. Cliff Hou, Senior Vice President of Europe and Asia Sales at TSMC. “With our comprehensive automotive technology platform, Socionext can quickly harness the power of 3nm for the computing needed for ADAS and AD without compromising safety and reliability, and we are excited to see the innovations they will bring to life”

Socionext will start designing with the early release of N3A process known as N3AE, to enable an accelerated schedule to mass production of automotive-grade products. Through early and close collaboration with TSMC, Socionext aims to be one of the first suppliers of high-performance and energy-efficient automotive products built on the most advanced N3A technology.

Samsung Electronics unveils automotive process strategy
HKSTP and J2 Semiconductor sign MOU
Renesas reveals new organisational structure
Cadence joins Arm Total Design
Socionext begins development of SoCs for Advanced ADAS and AD
Multi-year agreement for power semiconductors
X-FAB set to receive funding from the European IPCEI ME/CT
CEA-Leti launches AV R&D Program
Advantest Issues Call for Papers
NC State to lead Regional Semiconductor Innovation Hub
Semiconductor startup, Enosemi, launches
Selection Committee appoints CHIPS leaders
Amkor inaugurates latest factory in Vietnam
Infineon Technologies selects LTIMindtree
RED Semiconductor selected for government-backed ChipStart UK incubator
UK chip start-ups 'changing the future'
SPEA donates test equipment to university in Thailand
SONOTEC and S3 Alliance join at SEMICON Europa
Luminaries like high-NA EUV and curvilinear photomasks
SensiML and Silicon Technology join forces
TRI launches high-performance 3D AXI
SONOTEC and S3 Alliance join at SEMICON Europa
Marquee Semiconductor expands Indian presence
Micron begins Memory Manufacturing Fab
SiLC Technologies advances Machine Vision
Renesas partners with EdgeCortix
Gradiant acquires H+E Group
Webinar: Hydrogen Generation Industry Innovations to Meet Expanding North American Fab Hydrogen Requirements
EdgeCortix set to disrupt the edge market?
Evonetix places first DNA Synthesis Development Platform at Imperial College London
ASE launches Integrated Design Ecosystem
Cohu acquires Equiptest Engineering
Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: