+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Mouser Electronics adds over 16,000 new parts

News

Last quarter, Mouser launched more than 16,000 part numbers ready for shipment.

Some of the products introduced by Mouser from July through September include:


• Seeed Studio NVIDIA® Jetson Orin™ Nano 8GB Developer Kit

The NVIDIA Jetson Orin™ Nano 8GB Developer Kit by Seeed Studio delivers up to 40 TOPS performance for entry-level edge artificial intelligence (AI) and robotics. The kit includes a Jetson Orin Nano 8GB module, heat sink, carrier board, and power supply. The rich set of IOs includes USB 3.2 Gen 2 ports, 2x M.2 Key M for SSD, a pre-installed Wi-Fi® module, and more.

• STMicroelectronics VL53L7CH Time-of-Flight (ToF) Sensor

The VL53L7CH Time-of-Flight (ToF) sensor from STMicroelectronics features an ultrawide 90° diagonal field-of-view (FoV) and low power consumption. The compact and normalised histogram (CNH) innovative data output is specially designed for AI applications requiring multizone raw data from a high-performance multizone ToF sensor.

• Cree LED XLamp® XP-G4 LEDs

The XLamp XP-G4 LEDs from Cree LED incorporate the latest high-power LED technology advancements for improved optical performance while delivering industry-leading efficacy. The XP-G4 LEDs are optimised for a wide range of both indoor and outdoor directional lighting applications requiring precise light control, good colour over angle and long-term reliability.

• Molex Brad M12 Power L-Code Connector System

Providing space-saving flexibility with the power capacity needed for modern Industry 4.0 innovation, the Brad M12 Power L-Code connector system by Molex meets PROFIBUS and PROFINET International (PI) standards for PROFINET systems. The IP67-sealed connectors and Weld-Slag and Oil-Resistant (WSOR) cables ensure durability and reliability in harsh industrial environments.

Mouser Electronics adds over 16,000 new parts
Supermicro starts superchip-based server shipments
GlobalFoundries awarded $35m US funding
Controllable nonlinearity and coherence of polaritons in monolayer TMDs mesa cavities
Customised layers
Ansys receives four TSMC 2023 OIP Partner of the Year Awards
4JM Solutions expands Advantest relationship
Samsung Electronics holds Memory Tech Day 2023
Arm and Synopsys strengthen partnership
Solid Silicon Corp and Raptor Computing Systems collaborate
Atomera’s provides CHIPS expertise
Alphawave Semi, AI and Arm combine
Nordson Test & Inspection unveils next-gen X-Ray Inspection System
Ardian launches semiconductor investment platform
Infineon completes acquisition of GaN Systems
Mass Extraction detects the smallest defect sizes
TRI expands in Southeast Asia
SEMIFIVE Signs MOU with TeraPixel Technologies
EMD Electronics opens Arizona factory
SCREEN Semiconductor Solutions adopts FTD’s software platform
Synopsys partners with Indian Institute of Technology Bombay
Cadence wins four 2023 TSMC OIP Partner of the Year Awards
Samsung Electronics unveils automotive process strategy
HKSTP and J2 Semiconductor sign MOU
Renesas reveals new organisational structure
Cadence joins Arm Total Design
Socionext begins development of SoCs for Advanced ADAS and AD
Multi-year agreement for power semiconductors
X-FAB set to receive funding from the European IPCEI ME/CT
CEA-Leti launches AV R&D Program
Advantest Issues Call for Papers
NC State to lead Regional Semiconductor Innovation Hub
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: