Loading...
News Article

Microscope focused on high volume and high quality

News

The new Thermo Scientific Helios 6 HD Focused Ion Beam Scanning Electron Microscope (FIB-SEM) enables site-specific, ultra-thin sample preparation, designed to produce a high volume of quality transmission electron microscopy (TEM) data to support semiconductor manufacturers’ imaging and failure analysis needs during device design and fabrication.

This latest addition to Thermo Fisher Scientific’s family of industry standard DualBeam instruments can be operated manually, or in semi-automated fashion, and offers users the opportunity to achieve an increase in productivity compared to other commercially available solutions.

Delivering more samples per hour, and more high-quality sample output than previous generations, this new solution enables failure analysis labs the potential to reduce operating costs while delivering high quality TEM samples on a wide range of device technologies.

Key Applications:

Generate large volumes of high-quality TEM samples of various complexity. Increase production yields, enhance product quality and accelerate time to market.

Features/Benefits:

New FIB column design with automated source and column alignments enables higher system availability for increased productivity and more consistent results.

New digital scanning and patterning engine allows for simultaneous SEM imaging and milling, a 50X improvement in scan rotation precision and a more than 2X improvement in cut placement for more accurate pattern positioning, end-pointing on regions of interest and more successful TEM data samples compared to previous generations.  

New Thermo Scientific AutoTEM 6 Software supports achievement of a 45% decrease in setup time, and many productivity-and-ease-of-use improvements, including AI-enabled grid management and automatic alignment compared to previous generations.

New Thermo Scientific EasyLift NanoManipulator enables 3X longer intervals between needle change and therefore a 50% reduction in needle replacement time compared to previous generations.

Silicon photonics: accelerating growth in the race for high-speed optical interconnects
CCD-in-CMOS technology enables ultra-fast burst mode imaging
2025 6G A look forward
Critical Manufacturing climbs Deloitte’s Technology Fast 50
Semiconductors: The most important thing you probably know the least about
Imec and partners unveil SWIR sensor with lead-free quantum dot photodiodes
Lattice introduces small and mid-range FPGA offerings
SEMI and SMT inspection solutions at NEPCON Japan 2025
Nordic Semiconductor and Kigen demonstrate Remote SIM Provisioning for Massive IoT
Spirent collaborates with Siemens
Quobly forges strategic collaboration with STMicroelectronics
New standards in pressure measurement systems for the semiconductor industry
IBM delivers optics breakthrough
Semiconductor equipment sales to reach $139 Billion in 2026
Marvell introduces 1.6 Tbps LPO Chipset
ACM research strengthens Atomic Layer Deposition portfolio
CEA-Leti demonstrates embedded FeRAM platform compatible with 22nm FD-SOI node
Lattice introduces small and mid-range FPGA offerings
Solace unlocks full potential of event-driven integration
Advantest to showcase latest test solutions at SEMICON Japan 2024
CEA-Leti device integrates light sensing and modulation
Nordic launches Thingy:91 X prototyping platform for cellular IoT and Wi-Fi locationing
Imec achieves seamless InP Chiplet integration on 300mm RF Silicon Interposer
High-precision SMU
Powering India’s energy future
China’s Nvidia probe puts global investors ‘on notice’
POET Technologies appoints new director
Imec demonstrates core building blocks of a scalable, CMOS-fab compatible superconducting digital technology
Imec proposes double-row CFET for the A7 technology node
ULVAC launches new deposition system
Beebolt and SEMI Announce Strategic Partnership to Drive Supplier Resilience and Agility
esmo group introduces Automated Final Test Manipulator
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: