+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

DuPont collaborates with STMicroelectronics

News

New smart wearable device concept for monitoring biosignals.

DuPont Liveo Healthcare Solutions is collaborating with STMicroelectronics to develop a new smart wearable device concept for remote biosignal-monitoring.

The DuPont Liveo Smart Biosensing Patch concept supports the development of biosignal-monitoring devices with stable data quality and high patient comfort.

"Dedicated Liveo research teams collaborate with suppliers and manufacturers worldwide to create solutions across a vast array of medical applications – including smart devices that can share data between patients and doctors," said DuPont Liveo Global Business Leader Eugenio Toccalino. "The wearable device concept that resulted from the collaboration between DuPont and ST is the DuPont Liveo Smart Biosensing Patch prototype, which employs multifunctional microsensors and control electronics from ST embedded in a flexible patch design from DuPont."

By collaborating with others across the healthcare ecosystem – from technology developers and material suppliers to device fabricators and OEMs – DuPont is developing more patient-centric solutions that contribute to better patient outcomes.

"ST designed the electronics and sensors for the smart skin patch prototype using our accelerometer and vertical analog front end next-generation sensors with in-sensor AI, a microcontroller with Bluetooth module, ultra-low-power-management units, firmware, and algorithm support to create a flexible board design capable to analyze electrical and mechanical heart activity in full synchronization to extract multiple vital signs," said Simone Ferri, STMicroelectronics AMS Group Vice-President and MEMS sub-group General Manager. "The performance of ST's electronic sensors is enhanced by the conformability and conductivity of the DuPont™ Liveo™ materials used to create the patch."

Through this collaboration, DuPont brings a broad range of medical patch technologies, including DuPont Liveo Soft Skin Conductive Tape 1-3150 – a silicone-based thermoset adhesive for sensing and transferring electrical biosignals, and Liveo Soft Skin Adhesives.

ST's sensor and embedded development technology and semiconductor manufacturing expertise, combined with the key benefits of silicone technology with electrically conductive properties allow Liveo Soft Skin Conductive Tape technology to be used as a skin electrode for biosignal-monitoring applications where good skin conformability, no drying over time, and repositionability with gentle adhesion and atraumatic removal is vital. It can be used in single electrodes for short-term monitoring, as well as in medical wearable patches for long-term monitoring lasting seven or more days.

DuPont also designed the layout for the Liveo™ Smart Biosensing Patch and supplied rapid prototyping capabilities.

The result of this collaboration is not just a single prototype, but a robust ST-empowered Liveo Smart Biosensing Patch technology toolbox for remote ECG and SCG monitoring.

The DuPont and ST integrated patch technology is designed to improve people's lives, making it easier to use than typical rigid box designs. It's smaller, lighter, and more comfortable and can be worn longer. Plus, the sensors are multifunctional, intelligent, and adaptable, and the data provided is extremely stable.

Reality AI Explorer Tier offers free AI/ML development access
AEM introduces new generation of Automated Burn-In Systems
NPUs are emerging as the main rival to Nvidia’s AI dominance, says DAI Magister
Camtek receives a $20M order from a Tier-1 OSAT
Free samples of every STMicroelectronics NPI IC available from Anglia
NY CREATES and SEMI sign MoU
Major government investment to 'propel' Canada
QuickLogic announces $5.26 million contract award
ASNA and Athinia collaborate
Global sales forecast to reach record $109 billion in 2024
AMD to acquire Silo AI
Nanotronics unveils 'groundbreaking' Gen V AI Model
Aitomatic unveils SemiKong
Biden-Harris Administration reveals first CHIPS for America R&D facilities and selection processes
Collaboration to produce cutting-edge AI accelerator chips
Oxford Ionics breaks global quantum performance records
Adeia wins ECTC Award for paper on “Fine Pitch Die-to-Wafer Hybrid Bonding”
AEM introduces new generation of Automated Burn-In Systems
Sydney council forges vital semiconductor agreement
EV Group's EVG880 LayerRelease wins 2024 Best of West
Biden-Harris Administration to invest up to $1.6 billion
Cyient sets up subsidiary for semiconductor business
EMD Electronics network leaders honoured
Accenture acquires Cientra
Introducing Park FX200
Deep learning chipset market to surge to $72.8 billion by 2033
PI Innovation Award 2024: Nanobodies for Diagnostic and Therapeutic Applications
Graphcore joins Softbank Group
Kaman Measuring highlights high precision displacement sensors
Si2 reveals recipients of Annual Power of Partnerships Award
Advantest achieves ASPICE Level 2 Certification for V93000 SmarTest 8 Software
Semiconductors to become a trillion-dollar industry by 2030
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: