+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
News Article

GOWIN Semiconductor expands Arora V FPGA Family


GOWIN Semiconductor has expanded its Arora V high-performance FPGA family.

The latest offering leverages cutting-edge 22nm SRAM technology, 12.5Gbps high-speed SerDes interfaces, PCIe hardcore, MIPI hardcore D-phy and C-phy support, RISC-V microprocessor, and DDR3 interfaces. The extended family now includes 15K, 45K, 60K, and 75K LUT device offerings.

The new Arora V family not only complements the previous Arora family but also offers a significant performance boost with lower power consumption. Specifically, the Arora V devices exhibit 30% higher performance and a remarkable 60% reduction in power consumption compared to the Arora GW2A family. Arora-V programming configuration provides designers with a wide array of options including JTAG, SSPI, MSPI, CPU, and the ability to directly program external SPI Flash in JTAG or SSPI Mode. In addition, it allows for indirect programming of external Flash in other modes using a soft-core IP bridge and supports background upgrades, bitstream file encryption, and security bit settings.

Arora V further distinguishes itself by delivering exceptional Single Event Upset (SEU) resiliency compared to competitors. GOWIN has adopted an innovative approach by designing custom SRAM cells, significantly reducing soft error rate effects. To make the handling of SEU-related matters more accessible, GOWIN provides a "SEU Handler" wrapper IP, which allows users to seamlessly access SEU reports and correction functions, enhancing both reliability and efficiency.

The new Arora V family also incorporates an advanced I/O structure capable of recovering received serial data containing an embedded clock using built-in CDR technology at each differential I/O pair. This feature facilitates easy cascading of multiple GPIOs for achieving high data throughput, all without the need for a SERDES-based solution. Solutions such as Ethernet, Industrial Field Buses, and LVDS Bus Applications to name a few, can easily be implemented using EasyCDR.

“We are excited to be offering our latest 22nm technology products for next-generation applications during our innovation phase of growth,” states Scott Casper, Director of Sales, GOWIN Semiconductor, “The improvement in performance and speed as well as the added feature of EasyCDR will take us into solutions not realized by previous families.”

GOWIN Semiconductor expands Arora V FPGA Family
SureCore and Intrinsic collaborate
Focus is on efficiency and sustainability
Improving the reliability of wafer cleaning equipment
Atlas Copco to acquire Korean semiconductor valve manufacturer
A plan to 'revitalise' the semiconductor industry
Semiwise leads Virtual Reality Semiconductor Training Fab consortium
Vishay Intertechnology to acquire Nexperia's Newport wafer fab
Leading edge semiconductor research on 200/300 mm wafers
Advantest to showcase latest test solutions at SEMICON Europa
SHELLBACK acquires MERCURY+ Batch Spray Product Line from Tokyo Electron
Synopsys delivers 'seamless interoperability'
Taiwan and Japan join hands to build JSMC’s first fab in Miyagi Prefecture
Allegro MicroSystems acquires Crocus Technology
OMNIVISION introduces image sensor for laptops and IoT devices
Renesas unveils processor roadmap for automotive SoCs and MCUs
Infineon extends microcontroller portfolio
Intel's Oregon investments fuel US innovation
Finland can increase Europe’s competetive advantage
Siltronic AG produces first wafers in its new Singapore fab
AT&S provides IC-substrates for AMD
CommScope and STMicroelectronics collaborate
Chipset maximises smartphone performance and efficiency
Mycronic receives Prexision 8 Evo order
Veeco Ships first Nanosecond Annealing System
Automotive market Revving up: the intersection of semiconductors and the automotive industry
Contingent workers can be the boost Europe needs for its semiconductor sector
Increase manufacturing quality with reliable liquid flow measurement
Taking testing to the next level
Volkswagen Group reorganises semiconductor procurement strategy
Report focuses on value chain’s carbon emissions
Efficient semiconductor thermal management
Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: