+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
News Article

Picocom introduces system-on-chip for 5G small cell Open RAN radio units


PC805 – small footprint, low-power optimised SoC removes barriers to implementation of low-cost O-RUs.

Picocom has launched PC805, a new system-on-chip (SoC) optimised for 5G small cell Open RAN radio units (O-RUs). The highly integrated, small-footprint, low-power SoC is designed to ease the implementation of 5G NR/LTE small cell O-RUs to support a variety of deployment use cases. These include enterprise, industrial, neutral host and private networks.

Designing an O-RU with PC805 is greatly simplified and delivers a significantly reduced bill of materials compared to current designs. The SoC interfaces directly with O-DUs via Open Fronthaul (split 7.2) and supports seamless connections to RFICs with a standardised JESD204B high-speed serial interface. PC805 is shipped with a fully integrated O-RAN compliant Picocom 5G NR RU and M-plane software suite.

Peter Claydon, President of Picocom, said, “Most existing O-RU products are based on FPGA technology, necessitating a hardware redesign approach to address different use cases. Unlocking these new opportunities requires a more focused approach, where new use cases can be accommodated with simple software changes. That’s why I’m thrilled to introduce Picocom’s optimised yet flexible SoC for small cell radio units. PC805 will empower a new era of small cell deployments, answering the increasing calls from customers for more carrier aggregation and flexible spectrum utilisation.”

Peter Jarich, Head of GSMA Intelligence, noted, “Our research shows that operators see Open RAN as a strategic priority, with 5G – and 5G-Advanced - acting as a trigger for rethinking how networks are built. Optimised and readily available silicon is critical for the success of Open RAN, with a diverse set of sources being best for the industry. It’s good to see companies delivering optimised silicon for small cells, which are particularly important for neutral host and private network deployments along with network densification exercises.”

Oliver Davies, VP of Marketing at Picocom, added, “As 5G deployments progress, operators want to aggregate spectrum from different bands. This is especially true for neutral host operators, who often need to support the frequency allocations of several mobile operators or aggregate non-contiguous channels in shared spectrum. PC805 supports these use cases with a minimum of additional components, greatly reducing both capital and operating costs. Simply put, take PC805, add RF and a power supply, and you will have an O-RU!”

PC805 can perform aggregation of four or more 4T4R carriers in a 200 MHz instantaneous bandwidth (IBW), applicable for operation in the US CBRS and equivalent bands that are increasingly becoming available in other countries (for example, UK band n77 shared access band). A single PC805 can also support multiple bands, including both TDD and FDD for both 5G NR and LTE, with a cascade of two SoCs doubling the bandwidth supported.

PC805 launches with a complete software suite and a companion RU Demonstrator Board, the PC805RDB, to ease development and accelerate time-to-market. The PC805RDB is a flexible 5G NR/LTE Radio Unit board used to demonstrate the PC805 SoC with an onboard RF transceiver, front-end and associated support circuitry, and software. The PC805RDB integrates a Texas Instruments (TI) AFE7769D 4T4R RFIC, complete with an RF front end, based on an iCana demonstrator design.

PC805 is available in a 17mm x 17mm FC LFBGA Flip-Chip Ball Grid form factor, and Picocom will provide samples to lead customers from November 2023.

Reality AI Explorer Tier offers free AI/ML development access
AEM introduces new generation of Automated Burn-In Systems
NPUs are emerging as the main rival to Nvidia’s AI dominance, says DAI Magister
Camtek receives a $20M order from a Tier-1 OSAT
Free samples of every STMicroelectronics NPI IC available from Anglia
Major government investment to 'propel' Canada
QuickLogic announces $5.26 million contract award
ASNA and Athinia collaborate
Global sales forecast to reach record $109 billion in 2024
AMD to acquire Silo AI
Nanotronics unveils 'groundbreaking' Gen V AI Model
Aitomatic unveils SemiKong
Biden-Harris Administration reveals first CHIPS for America R&D facilities and selection processes
Collaboration to produce cutting-edge AI accelerator chips
Oxford Ionics breaks global quantum performance records
Adeia wins ECTC Award for paper on “Fine Pitch Die-to-Wafer Hybrid Bonding”
AEM introduces new generation of Automated Burn-In Systems
Sydney council forges vital semiconductor agreement
EV Group's EVG880 LayerRelease wins 2024 Best of West
Biden-Harris Administration to invest up to $1.6 billion
Cyient sets up subsidiary for semiconductor business
EMD Electronics network leaders honoured
Accenture acquires Cientra
Introducing Park FX200
Deep learning chipset market to surge to $72.8 billion by 2033
PI Innovation Award 2024: Nanobodies for Diagnostic and Therapeutic Applications
Graphcore joins Softbank Group
Kaman Measuring highlights high precision displacement sensors
Si2 reveals recipients of Annual Power of Partnerships Award
Advantest achieves ASPICE Level 2 Certification for V93000 SmarTest 8 Software
Semiconductors to become a trillion-dollar industry by 2030
Search the news archive

To close this popup you can press escape or click the close icon.
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: