+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Synopsys introduces Synopsys.ai Copilot

News

GenAI capability to accelerate chip design.

Synopsys has announced a 'breakthrough' generative artificial intelligence (GenAI) capability for accelerating chip design, Synopsys.ai Copilot. The new capability is the result of a strategic collaboration with Microsoft to integrate Azure OpenAI Service that brings the power of GenAI into one of the most complex engineering challenges - the design process for semiconductors.

Synopsys is a leader in semiconductor electronic design automation (EDA) and pioneered Synopsys.ai™, said to be the industry’s first AI-driven EDA suite. Azure OpenAI Service gives customers access to OpenAI’s large language models (LLMs) with the enterprise-ready capabilities of Microsoft Azure. Together, the companies collaborated to support Synopsys’ development of Synopsys.ai Copilot, bringing together Azure OpenAI Service generative AI capabilities with Synopsys’ industry-leading chip design tools and IP to help engineering teams accelerate time to market and address systemic complexity through the power of conversational intelligence.

“The semiconductor industry is racing to develop faster, more efficient, and optimized computing, which is also driving complexity. At the same time, we’re facing a projected 15% to 30% workforce gap for chip design engineers by 2030,” said Shankar Krishnamoorthy, general manager of the Synopsys EDA Group. “AI-driven design can help address these challenges. Synopsys pioneered AI-driven design with our Synopsys.ai EDA suite. Now, working collaboratively with Microsoft, we’re taking AI-driven design to the next level with generative capability such as conversational intelligence delivered in this first Synopsys.ai Copilot.”

This announcement builds on a vision of innovation between the two companies. In 2022, Synopsys introduced the industry’s first SaaS EDA solution powered by Microsoft Azure.

“Our history with Synopsys is built on a shared vision for accelerating semiconductor innovation through Cloud and AI,” said Corey Sanders, corporate vice president, Microsoft. “Microsoft’s engineering teams worked closely with Synopsys to bring the transformational power of Generative AI to EDA, which will empower semiconductor design engineers using the Synopsys.ai Copilot with the best AI infrastructure, models, and toolchain built on Microsoft Azure.”

This collaboration is designed to deliver:

• New AI-powered experiences: Synopsys.ai Copilot works alongside designers in the Synopsys tools they use every day, enabling conversational intelligence, in natural language, across the design team. Synopsys.ai Copilot, the first in a planned line of generative AI capability from Synopsys, is designed to learn new skills and grow with teams’ needs, making it easier for chipmakers to boost productivity and achieve design targets across all stages of chip design, from system architecture exploration to design and manufacturing.

• AI infrastructure at scale: Deployable in any on-prem or on-cloud environment, Synopsys.ai Copilot integrates Microsoft Azure on-demand high-performance computing infrastructure with the availability, affordability, and capacity to handle AI workloads for advanced chip design and verification applications.

• Safe and responsible design: Underpinning the collaboration is a mutual focus on building responsible AI systems that are safe and trustworthy. The intention of this framework is to promote the safe deployment of AI technologies in the creation of new silicon-based applications.

The combination of AI-powered design capabilities available at scale on high-performance infrastructure can deliver a step-function improvement in helping engineering teams innovate faster and more efficiently. Synopsys.ai Copilot is available now for early-access customers.

Tektronix and EA Elektro-Automatik offer expanded power portfolio
83% of supply chains can’t respond to disruptions in 24 hours
CMC Microsystems and ventureLAB sign MoU
Renesas introduces FemtoClock 3 timing solution
Mycronic receives order for SLX mask writer
Rapidus reveals US subsidiary and opens Silicon Valley office
Infineon introduces news MOTIX motor gate driver IC
Brewer Science unveils Smart Warehouse Monitor System
Symposium to showcase breakthroughs in microelectronics
CHIPS for America promotes over $50 million funding opportunity
SEMI University launches in-person courses
Samsung Electronics to establish Texan semiconductor ecosystem
Semiconductor chips drive innovation in AI and industries
Semiconductor equipment sales slip to $106.3 billion
Mouser Electronics receives 2023 Global Best Service Distributor of the Year Award from Diodes Incorporated
Quantum processor testing and measurement facilities up and running
Semiconductor Research Corporation announces 2024 call for research
Trend report unveils the future of circular electronics
PCIM Europe 2024: highlights and new records
PI contributes to technology node development
QP Technologies achieves ANSI/ESD S20.20 Certification
Renesas commences operations of Kofu Factory
TRI wins three Innovation Awards
Tektronix and recently acquired EA Elektro-Automatik offer expanded power portfolio
NEDO approves Rapidus’ FY2024 Plan and Budget
SK hynix signs Advanced Chip Packaging agreement
Renesas expands Quick Connect Studio
Infineon and Amkor deepen partnership
AP&S establishes site in the USA
Dracula Technologies selected by STMicroelectronics
RAIN RFID data to transform corporate sustainability initiatives
Integrated AMR replaces reed switches and hall effect sensors
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: