+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
News Article

Cadence EMX 3D Planar Solver certified for Samsung Foundry


EMX 3D Planar Solver empowers customers to achieve accurate, high-capacity EM analysis, resulting in first-pass silicon success and faster time to market.

Cadence Design Systems says that the Cadence® EMX® 3D Planar Solver is now certified for use with Samsung Foundry’s advanced 8nm Low Power Plus (LPP) process technology. The EMX Solver is said to be the first electromagnetic (EM) solver on the market to achieve this milestone, having successfully passed all of Samsung’s detailed certification criteria. Joint customers can confidently adopt the EMX Solver into their advanced designs to ensure highly accurate, high-capacity EM analysis, avoiding unintentional parasitics and crosstalk effects. Through this latest collaboration between Cadence and Samsung Foundry, customers can achieve first-pass silicon success and accelerate time to market.

A foundry-certified EM modeling engine is essential for successful block- and chip-level analysis and signoff. Accurate EM models are fundamental for designing ICs for today’s cutting-edge applications. A wide array of inductors featuring various configurations were manufactured and measured by Samsung for the certification process, and the EMX Solver performed with extremely high accuracy in all categories.

With the EMX Solver, customers can simulate large circuit blocks, characterize the EM behavior of passive components, and analyze on-chip parasitics. The solver can analyze advanced-node process fabrication effects, including width- and spacing-dependent effects. The EMX Solver is seamlessly integrated in Cadence’s custom/analog design flow with all Virtuoso® releases, including the AI-based Virtuoso Studio, as well as the Virtuoso Analog Design Environment and Spectre® RF Option.

“Through our longstanding collaboration with Cadence, we’ve provided customers with the powerful tools they need to achieve first-pass silicon success with advanced node designs,” said Sangyun Kim, vice president and head of the Foundry Design Technology Team at Samsung Electronics. “Our strong partnership ensures that customers can leverage the EMX 3D Planar Solver to accelerate design closure with our 8nm LPP process technology.”

“Today’s designs at advanced process nodes must withstand crosstalk effects,” said Ben Gu, corporate vice president of R&D for the Multiphysics System Analysis Business Unit at Cadence. “Accurate, high-capacity EM analysis is essential to safeguard these designs from unintentional parasitics. The Cadence EMX 3D Planar Solver is not only the industry’s gold-standard EM, it now boasts Samsung certification so that our mutual customers can continue designing at the very edge of the technology, confidently.”

The EMX 3D Planar Solver supports the Cadence Intelligent System Design™ strategy, enabling system-on-chip (SoC) design excellence and system innovation. For more information on the EMX 3D Planar Solver, please visit www.cadence.com/go/EMXSolverCertification.

Cadence EMX 3D Planar Solver certified for Samsung Foundry
Amkor Technology commits to SBTi
Samsung - the world’s 'most innovative' consumer electronics company
Arizona announces semiconductor apprenticeship programme
Cooperation in critical technologies such as AI and semiconductors
GlobalFoundries introduces Student Loan Repayment Program
STMicroelectronics selects Lucidworks
Pfeiffer Vacuum offers a new customized RGA system
SPAD devices for near-infrared applications
SAPEON launches X330 AI semiconductor for data centres
US forms partnership with Indonesia
Synopsys introduces Synopsys.ai Copilot
AI boom provides SUSS MicroTec with record orders for temporary bonders
Picocom introduces system-on-chip for 5G small cell Open RAN radio units
UC Irvine is member of Defense Department-funded microelectronics research hub
Infineon achieves record revenue and earnings
Inspection system offers a 'whole new level of safety and efficiency'
Nordic Semiconductor and AmberSemi partner
SiTime acquires clock products from Aura Semiconductor
Presto and T&W Engineering form long-term partnership
Worldwide semiconductor market outlook upgraded
JST Manufacturing launches Ospray single-wafer wet processing family
OMNIVISION launches OVMed Image Signal Processor
Infineon extends line of radiation-hardened asynchronous static RAMs
KYOCERA Fineceramics Europe doubles its production capacity in Germany
Nordic completes silicon-to-cloud locationing solution
Greene Tweed introduces Chemraz G57 Premium Elastomer
Silicon Austria Labs and EV Group strengthen collaboration
GOWIN Semiconductor expands Arora V FPGA Family
SureCore and Intrinsic collaborate
Focus is on efficiency and sustainability
Improving the reliability of wafer cleaning equipment
Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: