+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Commission launches Chips Joint Undertaking under the European Chips Act

News

The European Commission has officially inaugurated the Chips Joint Undertaking (Chips JU), designed to reinforce the European semiconductor ecosystem and Europe's technological leadership.

It will bridge the gap between research, innovation and production thereby facilitating the commercialisation of innovative ideas. The Chips JU will, among others, deploy pilot lines for which the Commission announced today the first call with €1.67 billion of EU funding. This is expected to be matched by funds from Member States to reach €3.3 billion, plus additional private funds.

In addition, the European Semiconductor Board held its first meeting recently. The Board brings together Member States to provide advice to the Commission on the consistent implementation of the European Chips Act and on international collaboration in semiconductors. It will be the key platform for coordination between the Commission, Member States, and stakeholders to address issues relating to the resilience of the supply chain and possible crisis responses.

The Chips Joint Undertaking

The Chips JU is the main implementer of the Chips for Europe Initiative (expected total budget €15.8 billion until 2030). The Chips JU aims at strengthening Europe's semiconductor ecosystem and economic security by managing an expected budget of nearly €11 billion by 2030, provided by the EU and participating states.

The Chips JU will:

• Set up pre-commercial, innovative pilot lines, providing industry state-of-the-art facilities to test, experiment and validate semiconductor technologies and system design concepts;

• Deploy a cloud-based Design Platform for design companies across the EU;

• Support the development of advanced technology and engineering capacities for quantum chips;

• Establish a network of competence centres and promote skills development.

The work of the Chips JU reinforces Europe's technological leadership by facilitating the transfer of knowledge from the lab to the fab, bridging the gap between research, innovation and industrial activities, and by promoting the commercialisation of innovative technologies by European industry including start-ups and SMEs.

First calls for funding Chips pilot lines

To launch its first calls for innovative pilot lines, the Chips JU will make €1.67 billion in EU funding available. The calls are open to organisations that wish to establish pilot lines in Member States, typically research and technology organisations, calling for proposals on:

• Fully Depleted Silicon on Insulator, towards 7 nm: This transistor architecture is a European innovation and has distinct advantages for high-speed and energy-efficient applications. A roadmap towards 7 nm will provide a path towards the next generation of high-performance, low-power semiconductor devices.

• Leading-edge nodes below 2 nm: This pilot line will focus on developing cutting-edge technology for advanced semiconductors at the size of 2 nanometres and below, which will play essential roles in a variety of applications, from computing to communication devices, transport systems and critical infrastructure.

• Heterogeneous system integration and assembly: Heterogeneous integration is an increasingly attractive technology for innovation and increased performance. It refers to the use of advanced packaging technologies and novel techniques to combine semiconductor materials, circuits or components into one compact system.

• Wide Bandgap semiconductors: The focus will be on materials that allow electronic devices to operate at much higher voltage, frequency and temperature than standard silicon-based devices. Wide bandgap and ultra-wide bandgap semiconductors are necessary to develop highly efficient power, lighter weight, lower costs and radio-frequency electronics.

The deadline for the calls for these pilot lines is in early March 2024.

Reality AI Explorer Tier offers free AI/ML development access
AEM introduces new generation of Automated Burn-In Systems
NPUs are emerging as the main rival to Nvidia’s AI dominance, says DAI Magister
Camtek receives a $20M order from a Tier-1 OSAT
Free samples of every STMicroelectronics NPI IC available from Anglia
NY CREATES and SEMI sign MoU
Major government investment to 'propel' Canada
QuickLogic announces $5.26 million contract award
ASNA and Athinia collaborate
Global sales forecast to reach record $109 billion in 2024
AMD to acquire Silo AI
Nanotronics unveils 'groundbreaking' Gen V AI Model
Aitomatic unveils SemiKong
Biden-Harris Administration reveals first CHIPS for America R&D facilities and selection processes
Collaboration to produce cutting-edge AI accelerator chips
Oxford Ionics breaks global quantum performance records
Adeia wins ECTC Award for paper on “Fine Pitch Die-to-Wafer Hybrid Bonding”
AEM introduces new generation of Automated Burn-In Systems
Sydney council forges vital semiconductor agreement
EV Group's EVG880 LayerRelease wins 2024 Best of West
Biden-Harris Administration to invest up to $1.6 billion
Cyient sets up subsidiary for semiconductor business
EMD Electronics network leaders honoured
Accenture acquires Cientra
Introducing Park FX200
Deep learning chipset market to surge to $72.8 billion by 2033
PI Innovation Award 2024: Nanobodies for Diagnostic and Therapeutic Applications
Graphcore joins Softbank Group
Kaman Measuring highlights high precision displacement sensors
Si2 reveals recipients of Annual Power of Partnerships Award
Advantest achieves ASPICE Level 2 Certification for V93000 SmarTest 8 Software
Semiconductors to become a trillion-dollar industry by 2030
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: