+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
News Article

Imec expands its US presence


Opening of R&D lab with Purdue and MoU with University of Michigan complement imec’s existing research activities in Florida.

Imec is joining forces with Purdue University for R&D on novel semiconductor materials, systems, and sustainable manufacturing and has a Memorandum of Understanding (MOU) with the University of Michigan to jointly advance semiconductor technologies for the automotive industry. As part of the collaboration agreements, imec will set up a physical presence in both locations to support smooth collaboration and enriched knowledge sharing – to the benefit of all parties.

Collaboration and internationalization have been the driving forces behind the chip industry’s gigantic strides forward. Over the past 40 years, imec has bridged the gap between universities and industry to drive semiconductor technologies and deep-tech innovations. Complementing its activities within the NeoCity ecosystem in Florida, imec is taking the next steps in expanding its collaborations with academia in the United States to fuel the semiconductor innovation pipeline.

On the Purdue University campus, a joint R&D lab was recently inaugurated in the presence of the Flemish Minister President Jan Jambon and Purdue President Mung Chiang. Here, imec and Purdue researchers will work together to develop and demonstrate novel semiconductor technologies, laying the foundation for the next wave of high-performance compute devices. This knowledge will also seed innovation to make semiconductor technologies and systems more sustainable.

In parallel, the University of Michigan and imec agreed in an MoU to perform joint research on semiconductor materials and system architectures that will primarily benefit the automotive industry. Michigan’s longstanding expertise in both automotive and microelectronics research, as well as its location in the heart of the US automotive ecosystem makes it an ideal partner in this collaborative effort.

“These collaboration agreements allow the states of Indiana and Michigan to tap into four decades of outstanding chip research,” explains Luc Van den hove, CEO of imec. “Moreover, establishing a physical presence in both locations will allow imec to intensify collaboration and boost R&D, resulting in new insights that can benefit the entire semiconductor value chain. These agreements underscore imec's unwavering commitment to invest in global collaboration to accelerate innovation in our industry and we are thankful for the support of Governors Holcomb and Whitmer for these initiatives.”

“Purdue University is excited to open this center with imec and IEDC on our campus after the ribbon-cutting ceremony today with Minister President Jambon. Built on the strength as a top-4 engineering college and patent-generating university in the U.S., Purdue is excited to be a leading university in semiconductors through Microelectronic Commons Hub, SCALE workforce consortium, US-Japan semiconductor alliance, and more. This partnership with imec will flourish as a strategically pivotal moment in the growing ecosystem of semiconductors in the heart of silicon heartland;" said Mung Chiang, Purdue President.

“The University of Michigan’s collaboration with imec brings the automotive and semiconductor industries together at an important time and place. To fulfill the most revolutionary promises of advanced mobility, we need to develop more reliable, energy-efficient, and powerful semiconductor solutions that are tailored for tomorrow’s transportation,” said Santa Ono, President of the University of Michigan. “We’re grateful to imec for catalyzing this effort and excited to lend our decades of research and educational expertise to moving it forward.”

Keysight joins the Car Connectivity Consortium
UK tech firms kick off commercial negotiations at SEMICON Korea
Security certification high
METIS report highlights skills requirements
GEN20-Q MBE system for quantum applications
UK chips funding boost
Advantest opens registration for International VOICE 2024 Developer Conference, June 3-5
Quantum success for Veeco
Nordic Semiconductor and Arm reaffirm partnership
Infineon and Honda enter strategic collaboration
Fully traceable RF calibration breakthrough
Intel and UMC announce new foundry collaboration
Infineon and GlobalFoundries extend long-term agreement
Semiconductor market to recover in 2024
Microprocessor architecture choice in the age of AI: exploring ARM and RISC-V
Filling the metrology void
Accelerating mechanical stress simulation for 3D-IC reliability in the cloud
Saras Micro Devices opens new HQ
Keysight and Samsung certify Electromagnetic Simulation Software
Intel opens Fab 9 in New Mexico
'Experience the Future' at TRI's Innovation Seminars
Infineon and Anker open joint Innovation Application Centre
Dry cleaning process for optimum cleaning results in electronics production
Dual agreements cement UK-Canada science and innovation ties
The complexities of onshoring chip production amidst geopolitical risks
Infineon achieves ISO/SAE 21434 certification for SLI37 automotive security controllers
Renesas Brings introduces RA8 Series MCUs for motor control applications
Eliminating external regulators in chiplet architectures
STMicroelectronics boosts chip design speed and enhances sustainability
Leveraging AI to efficiently test AI chips
TTI Europe becomes official distributor for PANJIT semiconductors
Semiconductor industry leads when it comes to patents
Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: