Loading...
News Article

Accuron Technologies acquires Recif Technologies

News

Accuron Technologies has acquired Recif Technologies, a France-based company specialising in the design, manufacture, and installation of robotic handling equipment for semiconductor wafer-handling.

This strategic move further solidifies Accuron’s growing footprint in the semiconductor industry and its presence in Europe.

"We are excited to welcome Recif into the Accuron family. With Recif's innovative solutions and expertise, I am convinced we will be better able to serve our industries better,” said TAN Kai Hoe, President & Group CEO of Accuron Technologies. “This strategic move aligns seamlessly with our vision for growth and continued leadership in the semiconductor value-chain. We look forward to enhancing our offerings and supporting Recif's growth on the global stage.”

The acquisition of Recif enhances Accuron's position as a key player in the semiconductor value-chain, and aligns with the Group's strategy for sustained growth and leadership in cutting-edge technology solutions. The addition of Recif will complement the technological capabilities of businesses currently in the Group's portfolio ­— including esmo AG, mechatronic systemtechnik, and NexGen Wafer Systems, who are leading players of niche applications in the semiconductor field. This synergy not only expands the Group's capabilities but also positions Accuron as a versatile and innovative provider in the chip industry, catering to a broader range of customer needs with an extended and integrated suite of cutting-edge solutions.

Recif boasts a long history of 'technological excellence' in the semiconductor sector and a global presence with offices in Taiwan and the USA, along with sales representatives covering Asia and Europe. The company's technical capabilities include an in-house R&D team overseeing product development and enhancement, and active participation in various European collaborative research programs.

Laurent SALANQUEDA, President and CEO of Recif Technologies, shared his perspective on the collaboration, saying, “Joining forces with Accuron opens up new horizons for Recif. Our shared commitment to providing best-in-class solutions positions us to greater value to our customers in the semiconductor industry. We are enthusiastic about the opportunities ahead and the synergies that will emerge as we combine our strengths to drive innovation and meet the evolving needs of the market.”

Accuron and Recif are confident that this acquisition will result in a stronger and more versatile organisation, better equipped to address the dynamic challenges of the semiconductor industry and drive further innovations in wafer-handling technology.

Silicon photonics: accelerating growth in the race for high-speed optical interconnects
CCD-in-CMOS technology enables ultra-fast burst mode imaging
2025 6G A look forward
Critical Manufacturing climbs Deloitte’s Technology Fast 50
Semiconductors: The most important thing you probably know the least about
Imec and partners unveil SWIR sensor with lead-free quantum dot photodiodes
Lattice introduces small and mid-range FPGA offerings
SEMI and SMT inspection solutions at NEPCON Japan 2025
Nordic Semiconductor and Kigen demonstrate Remote SIM Provisioning for Massive IoT
Spirent collaborates with Siemens
Quobly forges strategic collaboration with STMicroelectronics
New standards in pressure measurement systems for the semiconductor industry
IBM delivers optics breakthrough
Semiconductor equipment sales to reach $139 Billion in 2026
Marvell introduces 1.6 Tbps LPO Chipset
ACM research strengthens Atomic Layer Deposition portfolio
CEA-Leti demonstrates embedded FeRAM platform compatible with 22nm FD-SOI node
Lattice introduces small and mid-range FPGA offerings
Solace unlocks full potential of event-driven integration
Advantest to showcase latest test solutions at SEMICON Japan 2024
CEA-Leti device integrates light sensing and modulation
Nordic launches Thingy:91 X prototyping platform for cellular IoT and Wi-Fi locationing
Imec achieves seamless InP Chiplet integration on 300mm RF Silicon Interposer
High-precision SMU
Powering India’s energy future
China’s Nvidia probe puts global investors ‘on notice’
POET Technologies appoints new director
Imec demonstrates core building blocks of a scalable, CMOS-fab compatible superconducting digital technology
Imec proposes double-row CFET for the A7 technology node
ULVAC launches new deposition system
Beebolt and SEMI Announce Strategic Partnership to Drive Supplier Resilience and Agility
esmo group introduces Automated Final Test Manipulator
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: