+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Valens Semiconductor and Intel Foundry Services form strategic relationship

News

The strategic collaboration will accelerate adoption of the MIPI A-PHY standard technology for enhanced ADAS and safety boosting the industry’s chiplet vision.

Valens Semiconductor and Intel Foundry Services announce that IFS will fabricate Valens Semiconductor’s MIPI A-PHY chipsets using its advanced process nodes, aiming to address the robust demand in the market for this innovative connectivity solution. This collaboration furthers the strategic relationship between Valens and IFS that starts with the development of next generation of A-PHY in the automotive industry based on Intel leading-edge technology.

MIPI A-PHY is the first automotive industry standard developed for in-vehicle high-speed sensor connectivity. Since its release in 2020, it has attracted a growing ecosystem of companies designing products based on the technology. Valens Semiconductor, a key contributor to the standard, was the first on the market to offer A-PHY-compliant chipsets with its VA7000 product family.

“Best-in-class products, like our A-PHY chipsets, require best-in-class processes – and that’s exactly what we’re getting through this collaboration with Intel Foundry Services” said Gideon Ben Zvi, CEO of Valens Semiconductor. “With the full suite of resources Intel offers, including advanced process and packaging technologies, and a broad IP portfolio, we’re confident that we can further advance our A-PHY products. As a leader in MIPI A-PHY, we are proud to provide the most resilient high-performance connectivity technology, enabling significantly safer cars in the future.”

As part of this strategic collaboration, Valens Semiconductor will utilize Intel’s leading edge process technology to produce its secondgeneration of A-PHY chipsets. Intel’s ecosystem and advancedprocesses will enable significant cost and power reductions for this chipset family while achieving the highest-performance and flawless Electromagnetic Compatibility (EMC). With the significant increase in bandwidth and other architecture requirements, this unique set of capabilities ensure link performance and passenger safety are maintained at all times.

“One of the goals of Intel Foundry Services is to identify transformative technologies, and harness Intel’s breakthrough process technology and global ecosystem to accelerate innovation and unlock new opportunities for our customers,” said Stuart Pann, Senior Vice President and General Manager, Intel Foundry Services. “The MIPI A-PHY chipset is an obvious fit – a next-generation technology with the potential for broad market adoption that can help advance automotive performance and safety and further the autonomous vision.”

This collaboration will play a significant role in boosting the vision for a chiplet architecture in the automotive industry. With its reliance on advanced package integration and the use of standardized interfaces such as UCIe, the chiplet architecture will be complimented by MIPI A-PHY as the standardized connectivity interface. This is the best way to meet the automotive market’s requirements for high reliability, high performance, and low latency, and MIPI A-PHY will be a key enabler of this next-generation silicon architecture.

Reality AI Explorer Tier offers free AI/ML development access
AEM introduces new generation of Automated Burn-In Systems
NPUs are emerging as the main rival to Nvidia’s AI dominance, says DAI Magister
Camtek receives a $20M order from a Tier-1 OSAT
Free samples of every STMicroelectronics NPI IC available from Anglia
NY CREATES and SEMI sign MoU
Major government investment to 'propel' Canada
QuickLogic announces $5.26 million contract award
ASNA and Athinia collaborate
Global sales forecast to reach record $109 billion in 2024
AMD to acquire Silo AI
Nanotronics unveils 'groundbreaking' Gen V AI Model
Aitomatic unveils SemiKong
Biden-Harris Administration reveals first CHIPS for America R&D facilities and selection processes
Collaboration to produce cutting-edge AI accelerator chips
Oxford Ionics breaks global quantum performance records
Adeia wins ECTC Award for paper on “Fine Pitch Die-to-Wafer Hybrid Bonding”
AEM introduces new generation of Automated Burn-In Systems
Sydney council forges vital semiconductor agreement
EV Group's EVG880 LayerRelease wins 2024 Best of West
Biden-Harris Administration to invest up to $1.6 billion
Cyient sets up subsidiary for semiconductor business
EMD Electronics network leaders honoured
Accenture acquires Cientra
Introducing Park FX200
Deep learning chipset market to surge to $72.8 billion by 2033
PI Innovation Award 2024: Nanobodies for Diagnostic and Therapeutic Applications
Graphcore joins Softbank Group
Kaman Measuring highlights high precision displacement sensors
Si2 reveals recipients of Annual Power of Partnerships Award
Advantest achieves ASPICE Level 2 Certification for V93000 SmarTest 8 Software
Semiconductors to become a trillion-dollar industry by 2030
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: