+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Siemens collaborates with sureCore and Semiwise

News

Siemens collaborates with sureCore and Semiwise to pioneer quantum computing ready cryogenic semiconductor designs.

Siemens Digital Industries Software is with sureCore and Semiwise to develop 'groundbreaking' cryogenic CMOS circuits capable of operating at temperatures near absolute zero – a fundamental component of quantum computing systems. The joint effort holds the potential for dramatic advances in both performance and power efficiency for next-generation integrated circuits (IC) targeting quantum computing – considered the leading edge in the high-performance computing (HPC) research and development.

The key to unlocking the potential of quantum computing for HPC and other fast-growing applications lies in the availability of control electronics capable of operating at cryogenic temperatures. Using advanced analog/mixed-signal IC design technology from Siemens, Semiwise has developed cryogenic CMOS circuit designs featuring cryogenic SPICE models as well as SPICE simulator technology that can perform accurate analyses at cryogenic temperatures.

Semiwise is providing this intellectual property (IP), developed using Siemens’ Analog FastSPICE (AFS), to sureCore for the development of sureCore’s revolutionary line of CryoIP, which aims to enable the design of CryoCMOS control chips seen as crucial for unlocking the commercial potential for quantum computing.

In the development of its CryoIP product line, sureCore also used Siemens’s Analog FastSPICE platform and Siemens’ Solido™ Design Environment software, both of which demonstrated reliable and accurate operation at cryogenic temperatures, empowering sureCore to construct analog circuits, standard cell libraries, and memory designs including SRAM, register files, and ROM, using Semiwise’s cryogenic transistor models. Further, Siemens’ Analog FastSPICE software showcased exceptional capabilities in handling foundry device models at cryogenic conditions, helping deliver efficient analog, mixed-signal, and digital circuit design and verification functionality without convergence issues. The result is a high level of accuracy and performance, setting the stage for potentially groundbreaking advancements in quantum computing.

sureCore is rapidly progressing towards its first CryoIP tapeout, leveraging GlobalFoundries' 22FDX® PDK.

Paul Wells, CEO of sureCore, underscored the pivotal role of this partnership. "The critical storage element and the bit cell must essentially be treated as an analog circuit that is highly sensitive to process variability and mismatch,” said Wells. “When we develop new memory designs and their associated compilers, we need to run thousands of statistical circuit simulations to guarantee the yield and reliability of our IP. Our partnership with Siemens EDA has enabled us to leverage Siemens' Custom IC verification technology to build robust cryogenic IP cores, specifically tailored for Quantum applications."

"This partnership symbolizes Siemens' unwavering dedication to advancing the quantum computing domain,” said Amit Gupta, general manager and vice president of the Custom IC Verification Division, Siemens Digital Industries Software. “The groundbreaking technologies and solutions developed have the potential to redefine the boundaries of high-performance computing."

Siemens' Analog FastSPICE platform, powered by technology from Siemens’ Analog FastSPICE eXTreme™ platform, offers circuit verification for nanometer analog, radio frequency (RF), mixed-signal, memory, and custom digital circuits. It holds foundry certifications across all major foundries and is qualified across various process nodes, from mature to the most advanced. Siemens' Analog FastSPICE platform offers a comprehensive use model, including small signal, transient, RF, noise, aging, and multi-sim verification capabilities, with drop-in compatibility with industry-standard SPICE-based flows. This all-encompassing solution boasts high performance, capacity, and flexible features.

Siemens' Solido Design Environment plays a pivotal role by providing a comprehensive cockpit for nominal and variation-aware analysis and encompasses SPICE-level circuit simulation setup, measurements, regressions, waveforms, and statistical results analysis. Powered by AI technology, Solido Design Environment assists users in identifying optimization paths to improve circuit power, performance, and area - facilitating production-accurate statistical yield analysis, reducing runtime compared to brute-force methods.

The challenge of decarbonizing the semiconductor industry and fulfilling chip demand
Toppan Photomask signs agreement with IBM
Korean AI chipmaker Rebellions closes $124M Series B fundraise
Avnet and indie Semiconductor enter global distribution agreement
Keysight joins the Car Connectivity Consortium
UK tech firms kick off commercial negotiations at SEMICON Korea
Security certification high
METIS report highlights skills requirements
GEN20-Q MBE system for quantum applications
UK chips funding boost
Advantest opens registration for International VOICE 2024 Developer Conference, June 3-5
Quantum success for Veeco
Nordic Semiconductor and Arm reaffirm partnership
Infineon and Honda enter strategic collaboration
Fully traceable RF calibration breakthrough
Intel and UMC announce new foundry collaboration
Infineon and GlobalFoundries extend long-term agreement
Semiconductor market to recover in 2024
Microprocessor architecture choice in the age of AI: exploring ARM and RISC-V
Filling the metrology void
Accelerating mechanical stress simulation for 3D-IC reliability in the cloud
Saras Micro Devices opens new HQ
Keysight and Samsung certify Electromagnetic Simulation Software
Intel opens Fab 9 in New Mexico
'Experience the Future' at TRI's Innovation Seminars
Infineon and Anker open joint Innovation Application Centre
Dry cleaning process for optimum cleaning results in electronics production
Dual agreements cement UK-Canada science and innovation ties
The complexities of onshoring chip production amidst geopolitical risks
Infineon achieves ISO/SAE 21434 certification for SLI37 automotive security controllers
Renesas Brings introduces RA8 Series MCUs for motor control applications
Eliminating external regulators in chiplet architectures
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: