Loading...
News Article

Honeywell and NXP Semiconductors collaborate

News

Enhanced machine learning and autonomous decision-making will help enable more energy efficient, convenient solutions.

Honeywell and NXP® Semiconductors have signed a Memorandum of Understanding (MOU) to help optimise the way commercial buildings sense and securely control energy consumption.

According to the International Energy Agency (IEA), buildings' operations contribute to 30 percent of global final energy consumption and 26 percent of global energy-related emissions, so decisions made today will significantly impact future energy use and potential savings. Today's smart energy solutions increasingly leverage machine learning and data analytics to enhance buildings' autonomy and energy efficiency.

The collaboration aims to help make buildings operate more intelligently by integrating NXP Semiconductors' neural network-enabled, industrial-grade applications processors into Honeywell's building management systems (BMS). The MOU will initially focus on the Honeywell Optimizer Suite, which offers a flexible, more future-proofed building control and automation platform.

More broadly, the efforts aim to deliver smart energy solutions powered by AI/machine learning and data analytics to enhance building autonomy, driving energy efficiency while guiding service technicians. The goal is to fully leverage NXP's neural network-enabled i.MX chipset capabilities to further enhance Honeywell's BMS product offerings.

"Buildings are increasingly relying on data and the ability to control operations via automation to make them more sustainable while operating more efficiently," said Suresh Venkatarayalu, Honeywell's chief technology officer. "NXP's latest machine learning solutions will help us deliver excellence in building automation for our customers."

"It has never been more important to increase the sustainability and comfort of smart buildings," said Lars Reger, NXP Semiconductors' chief technology officer. "NXP's advanced portfolio of securely connected processing solutions are supported by easy-to-use tools for rapid AI model development and service platform for provisioning and managing IoT devices throughout the long building management lifecycle. This capability, combined with Honeywell's expertise as one of the leading building management solution providers, marks an important milestone in our shared vision to enable a smarter, more connected world for all."

Honeywell will build on NXP's scalable semiconductor and software solutions, such as the i.MX 8M applications processors and i.MX RT crossover microcontrollers, to help securely observe, learn and adapt in real time, enhancing analytics and decision-making in the same on-site BMS equipment that manages critical building systems. Augmented by cloud-based big data analytics through the Honeywell Forge analytics solutions, buildings can increasingly leverage better foresight and insight for energy usage optimisation to enable improved sustainability outcomes.

Silicon photonics: accelerating growth in the race for high-speed optical interconnects
CCD-in-CMOS technology enables ultra-fast burst mode imaging
2025 6G A look forward
Critical Manufacturing climbs Deloitte’s Technology Fast 50
Semiconductors: The most important thing you probably know the least about
Imec and partners unveil SWIR sensor with lead-free quantum dot photodiodes
Lattice introduces small and mid-range FPGA offerings
SEMI and SMT inspection solutions at NEPCON Japan 2025
Nordic Semiconductor and Kigen demonstrate Remote SIM Provisioning for Massive IoT
Spirent collaborates with Siemens
Quobly forges strategic collaboration with STMicroelectronics
New standards in pressure measurement systems for the semiconductor industry
IBM delivers optics breakthrough
Semiconductor equipment sales to reach $139 Billion in 2026
Marvell introduces 1.6 Tbps LPO Chipset
ACM research strengthens Atomic Layer Deposition portfolio
CEA-Leti demonstrates embedded FeRAM platform compatible with 22nm FD-SOI node
Lattice introduces small and mid-range FPGA offerings
Solace unlocks full potential of event-driven integration
Advantest to showcase latest test solutions at SEMICON Japan 2024
CEA-Leti device integrates light sensing and modulation
Nordic launches Thingy:91 X prototyping platform for cellular IoT and Wi-Fi locationing
Imec achieves seamless InP Chiplet integration on 300mm RF Silicon Interposer
High-precision SMU
Powering India’s energy future
China’s Nvidia probe puts global investors ‘on notice’
POET Technologies appoints new director
Imec demonstrates core building blocks of a scalable, CMOS-fab compatible superconducting digital technology
Imec proposes double-row CFET for the A7 technology node
ULVAC launches new deposition system
Beebolt and SEMI Announce Strategic Partnership to Drive Supplier Resilience and Agility
esmo group introduces Automated Final Test Manipulator
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: