+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

'Experience the Future' at TRI's Innovation Seminars

News

Test Research, Inc. (TRI) will feature Innovative Inspection Solutions, SPI, AOI, AXI, and ICT solutions at a series of technology seminars and product demos held in Taiwan, Shenzhen, and Suzhou.

Each of the one-day events will focus on the latest test and inspection technology innovations for SMT and Advanced Packaging production, including the Smart Factory and AI-powered Solutions. TRI's 2024 portfolio will showcase High-Speed Line inspection platforms, such as the TR7700QH SII, capable of inspecting at speeds of 80cm²/s. During the seminars, there will be a demonstration of TRI's High-Accuracy and High-Resolution line for Advanced Packaging Inspection. The lineup will also feature X-ray Inspection demonstrations, such as the 3D CT AXI TR7600F3D LL SII with an improved platform for High-Speed Inspection.

Additionally, TRI will showcase Board Testing platforms, such as the TR5001 SII series with LED Analyzer for Automotive applications and the High-Pin Count Tester TR8100HL SII for High-throughput production lines. Lastly, there will be a live demo of TRI's AI-powered Solutions and the improved Yield Management System 4.0 (YMS 4.0).

Reality AI Explorer Tier offers free AI/ML development access
AEM introduces new generation of Automated Burn-In Systems
NPUs are emerging as the main rival to Nvidia’s AI dominance, says DAI Magister
Camtek receives a $20M order from a Tier-1 OSAT
Free samples of every STMicroelectronics NPI IC available from Anglia
NY CREATES and SEMI sign MoU
Major government investment to 'propel' Canada
QuickLogic announces $5.26 million contract award
ASNA and Athinia collaborate
Global sales forecast to reach record $109 billion in 2024
AMD to acquire Silo AI
Nanotronics unveils 'groundbreaking' Gen V AI Model
Aitomatic unveils SemiKong
Biden-Harris Administration reveals first CHIPS for America R&D facilities and selection processes
Collaboration to produce cutting-edge AI accelerator chips
Oxford Ionics breaks global quantum performance records
Adeia wins ECTC Award for paper on “Fine Pitch Die-to-Wafer Hybrid Bonding”
AEM introduces new generation of Automated Burn-In Systems
Sydney council forges vital semiconductor agreement
EV Group's EVG880 LayerRelease wins 2024 Best of West
Biden-Harris Administration to invest up to $1.6 billion
Cyient sets up subsidiary for semiconductor business
EMD Electronics network leaders honoured
Accenture acquires Cientra
Introducing Park FX200
Deep learning chipset market to surge to $72.8 billion by 2033
PI Innovation Award 2024: Nanobodies for Diagnostic and Therapeutic Applications
Graphcore joins Softbank Group
Kaman Measuring highlights high precision displacement sensors
Si2 reveals recipients of Annual Power of Partnerships Award
Advantest achieves ASPICE Level 2 Certification for V93000 SmarTest 8 Software
Semiconductors to become a trillion-dollar industry by 2030
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: