Loading...
News Article

SIA applauds over $5 billion in CHIPS R&D investments

News

US administration announces launch of National Semiconductor Technology Center as well as funding for chip workforce, other programs.

The Semiconductor Industry Association (SIA) has released the following statement from SIA President and CEO John Neuffer commending the administration’s launch of over $5 billion in semiconductor R&D investments through the National Semiconductor Technology Center (NSTC), as well as funding for vital semiconductor workforce initiatives and other programs. The NSTC is a critically important entity established by the CHIPS and Science Act of 2022 to promote U.S. semiconductor R&D. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.

“Today’s announcement ushers in the next phase of implementing the landmark semiconductor R&D and workforce initiatives in the CHIPS and Science Act and fulfilling its tremendous promise to reinforce America’s economy, national security, and technological leadership. We applaud leaders in Washington for advancing funding for the NSTC and other vital semiconductor programs. I was honored to attend today’s announcement at the White House, and we look forward to continuing to work with the administration to ensure effective and expeditious implementation of these initiatives, which will strengthen U.S. semiconductor innovation, production, and the domestic chip workforce for many years to come.”

Semiconductor R&D fuels America’s economic growth, national security, and technological competitiveness. The NSTC was established to invigorate semiconductor innovation in the U.S. and drive workforce development opportunities to meet the needs of our rapidly growing industry.

SIA and the Boston Consulting Group (BCG) in October 2022 released a report identifying five key areas of the semiconductor R&D ecosystem that should be strengthened by the CHIPS Act’s R&D funding. The report, titled “American Semiconductor Research: Leadership Through Innovation,” highlights the importance of government-industry collaboration on the NSTC and the National Advanced Packaging Manufacturing Program (NAPMP). The study also calls for CHIPS funding to be used to bridge key gaps in the current semiconductor R&D ecosystem to help pave the way for sustained U.S. chip innovation leadership.

The CHIPS Act’s manufacturing incentives have already sparked substantial investments in the U.S. In fact, companies in the semiconductor ecosystem have announced dozens of new projects across America—totaling more than $220 billion in private investments—since the CHIPS Act was introduced. These announced projects will create more than 40,000 jobs in the semiconductor ecosystem and support hundreds of thousands of additional U.S. jobs throughout this economy.

Silicon photonics: accelerating growth in the race for high-speed optical interconnects
CCD-in-CMOS technology enables ultra-fast burst mode imaging
2025 6G A look forward
Critical Manufacturing climbs Deloitte’s Technology Fast 50
Semiconductors: The most important thing you probably know the least about
Imec and partners unveil SWIR sensor with lead-free quantum dot photodiodes
Lattice introduces small and mid-range FPGA offerings
SEMI and SMT inspection solutions at NEPCON Japan 2025
Nordic Semiconductor and Kigen demonstrate Remote SIM Provisioning for Massive IoT
Spirent collaborates with Siemens
Quobly forges strategic collaboration with STMicroelectronics
New standards in pressure measurement systems for the semiconductor industry
IBM delivers optics breakthrough
Semiconductor equipment sales to reach $139 Billion in 2026
Marvell introduces 1.6 Tbps LPO Chipset
ACM research strengthens Atomic Layer Deposition portfolio
CEA-Leti demonstrates embedded FeRAM platform compatible with 22nm FD-SOI node
Lattice introduces small and mid-range FPGA offerings
Solace unlocks full potential of event-driven integration
Advantest to showcase latest test solutions at SEMICON Japan 2024
CEA-Leti device integrates light sensing and modulation
Nordic launches Thingy:91 X prototyping platform for cellular IoT and Wi-Fi locationing
Imec achieves seamless InP Chiplet integration on 300mm RF Silicon Interposer
High-precision SMU
Powering India’s energy future
China’s Nvidia probe puts global investors ‘on notice’
POET Technologies appoints new director
Imec demonstrates core building blocks of a scalable, CMOS-fab compatible superconducting digital technology
Imec proposes double-row CFET for the A7 technology node
ULVAC launches new deposition system
Beebolt and SEMI Announce Strategic Partnership to Drive Supplier Resilience and Agility
esmo group introduces Automated Final Test Manipulator
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: