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Brewer Science to present innovative materials and processes at SPIE Conference

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Brewer Science will presents material advancements and innovative processes at leading semiconductor event SPIE Advanced Lithography + Patterning in San Jose, California.


With over 40 years of experience innovating semiconductor materials and processes, Brewer Science presents how to achieve enhanced performance and efficiency in semiconductor manufacturing. Three presentations will be featured at SPIE Advanced Lithography and Patterning conference.

All three presentations share a common theme of advancing materials and processes in semiconductor manufacturing and optical device fabrication. The presentations focus on improving performance and efficiency in their respective domains through the exploration of novel materials, underlayers, and fabrication techniques. Whether it’s optimizing lithography in 14-nm extreme ultraviolet lithography (EUVL), enhancing the lithographic performance of metal oxide resist (MOR) technology via underlayers, or developing high- and low-refractive-index materials for next-generation optical devices, these presentations contribute to the ongoing evolution of technologies that are crucial for the semiconductor and optical industries. They showcase a commitment to innovation, precision, and the pursuit of materials that enable more advanced and reliable manufacturing processes, ultimately impacting the performance and capabilities of electronic devices and optical systems.

Presentations address crucial advancement in semiconductor innovation

Dr. Si (Elly) Li will present Lithography performance improvement of MOR by underlayers on February 28th, at 2:40pm PST. The presentation evaluates how optimizing underlayers enhances MOR performance in lithography, including reducing dose and footing. Read the full presentation abstract on the event website.

During the poster session, Dr. Xinlin Lu will present Understanding and improving performance of 14-nm HP EUV lithography via rational design of materials, which examines a new spin-on glass underlayer with improved properties enhances EUV lithography performance compared to conventional underlayers. Read the full presentation abstract on the event website.

Dr. Reuben Chacko will present High- and low-refractive-index materials with high transmission for next-generation optical devices during the poster session on February 28th at 5:30pm PST which evaluates how growing AR/VR demand fuels optical components for near eye display; emphasis on high-performance, flexible polymeric materials with advanced features like spin-coat-friendly films and low-temperature-processed ultralow-refractive-index materials. Read the full presentation abstract on the event website.

Additionally, Dr. Douglas Guerrero, Senior Technologist at Brewer Science and chair of the Advances in Patterning Materials and Processes conference, co-authored three papers that are scheduled to be presented at the conference.

Functional underlayers, surface priming and multilayer stacks to improve dose and adhesion of EUV photoresists

Light curable underlayers for non-baking process in EUV lithography

Machine, process and material efforts towards sustainable lithography

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