+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
Vendor View

Brewer Science to present innovative materials and processes at SPIE Conference

Brewer Science will presents material advancements and innovative processes at leading semiconductor event SPIE Advanced Lithography + Patterning in San Jose, California.

With over 40 years of experience innovating semiconductor materials and processes, Brewer Science presents how to achieve enhanced performance and efficiency in semiconductor manufacturing. Three presentations will be featured at SPIE Advanced Lithography and Patterning conference.

All three presentations share a common theme of advancing materials and processes in semiconductor manufacturing and optical device fabrication. The presentations focus on improving performance and efficiency in their respective domains through the exploration of novel materials, underlayers, and fabrication techniques. Whether it’s optimizing lithography in 14-nm extreme ultraviolet lithography (EUVL), enhancing the lithographic performance of metal oxide resist (MOR) technology via underlayers, or developing high- and low-refractive-index materials for next-generation optical devices, these presentations contribute to the ongoing evolution of technologies that are crucial for the semiconductor and optical industries. They showcase a commitment to innovation, precision, and the pursuit of materials that enable more advanced and reliable manufacturing processes, ultimately impacting the performance and capabilities of electronic devices and optical systems.

Presentations address crucial advancement in semiconductor innovation

Dr. Si (Elly) Li will present Lithography performance improvement of MOR by underlayers on February 28th, at 2:40pm PST. The presentation evaluates how optimizing underlayers enhances MOR performance in lithography, including reducing dose and footing. Read the full presentation abstract on the event website.

During the poster session, Dr. Xinlin Lu will present Understanding and improving performance of 14-nm HP EUV lithography via rational design of materials, which examines a new spin-on glass underlayer with improved properties enhances EUV lithography performance compared to conventional underlayers. Read the full presentation abstract on the event website.

Dr. Reuben Chacko will present High- and low-refractive-index materials with high transmission for next-generation optical devices during the poster session on February 28th at 5:30pm PST which evaluates how growing AR/VR demand fuels optical components for near eye display; emphasis on high-performance, flexible polymeric materials with advanced features like spin-coat-friendly films and low-temperature-processed ultralow-refractive-index materials. Read the full presentation abstract on the event website.

Additionally, Dr. Douglas Guerrero, Senior Technologist at Brewer Science and chair of the Advances in Patterning Materials and Processes conference, co-authored three papers that are scheduled to be presented at the conference.

Functional underlayers, surface priming and multilayer stacks to improve dose and adhesion of EUV photoresists

Light curable underlayers for non-baking process in EUV lithography

Machine, process and material efforts towards sustainable lithography

Imec pioneers low-power UWB receiver chip
New eBook from Mouser and Analog Devices
Keysight joins U.S. Commerce Department’s AI Safety Institute Consortium
Greene Tweed names industry veteran Justine Franchina as COO
Arizona Commerce Authority allocates funding to NAU
SwissChips Initiative to boost Swiss chip industry
Five facilities in five years for India?
Brewer Science to present innovative materials and processes at SPIE Conference
VTT explores how to make communications smoother with quantum computing
SIA applauds over $5 billion in CHIPS R&D investments
ASMC 2024 to spotlight advanced innovations
Siemens acquires high-performance visual inspection company "Inspekto"
Optimising predictive maintenance
Industry poised for 2024 recovery
zeroRISC, Nuvoton and Winbond join forces
Infineon drives decarbonisation and digitalisation
ROHM introduces new SBDs
Imec launches Design Pathfinding Process Design Kit for N2 Node
High-speed line inspection at the IPC APEX EXPO 2024
Renesas to acquire PCB design software leader Altium
SK hynix unveils recycled materials roadmap
Supporting quantum workforce development
Ichor receives Supplier Excellence Award from Applied Materials
Empower Semiconductor showcases IVRs
Bruker acquires Nanophoton Corporation
Government backs Kioxia and Western Digital’s JV
Webinar focuses on Precision Electronics for Scientific Discovery
The challenge of decarbonizing the semiconductor industry and fulfilling chip demand
Toppan Photomask signs agreement with IBM
Korean AI chipmaker Rebellions closes $124M Series B fundraise
Avnet and indie Semiconductor enter global distribution agreement
Keysight joins the Car Connectivity Consortium
Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: