+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

eSync technology brings Cyient into the Alliance

News

Cyient joins a rapidly expanding network of businesses as an eSync Alliance member.

With the momentum for a standardized approach to automotive over-the-air (OTA) connectivity growing, eSync Alliance has added Cyient, a global Intelligent Engineering and Technology Solutions company, to its member base.

For more than two decades, Cyient has been a recognized leader in automotive and semiconductor systems and software sectors, providing innovative automotive silicon and software design solutions to global OEMs and Tier-1s. Cyient also has extensive experience in end-to-end automotive embedded systems development, applied in key focus areas, including digital cockpits and In-vehicle Infotainment systems (IVI), advanced driver assistance systems (ADAS), vehicle electrification, and powertrain and connected car technology.

Cyient's solutions will pave the way to enabling zero accidents and create a bespoke user environment, leveraging its capabilities in automotive software application and platform development, automotive embedded systems and cyber security, automotive system-on-chips (SoC), ASIC silicon design, cloud-native non-critical automotive applications, and automotive electronic control unit (ECU) development.

As with all eSync Alliance's members, Cyient understands the power of an industry standard to facilitate rapid and wide-reaching innovation. The business already builds its systems on the classic & adaptive AUTOSAR standardized automotive software architecture – itself an alliance between OEM manufacturers, software developers and suppliers. As every customer solution produced by Cyient is ISO 26262 compliant, the ability to use the eSync specification to enable ISO 26262 compliance for OTA updates with cyber security enabled is a key benefit for the company.

"We are glad to be part of eSync Alliance," said Rajaneesh Kini, President & Chief Technology Officer, Cyient. "We look forward to working with all members of the eSync Alliance and progressing toward OTA standardizations and innovations. Cyient continues to invest in enabling intelligent mobility solutions for our customers, and modernized OTA systems are key to this journey. As an engineering and technology solutions provider, we are excited to work closely with industry experts, equipment manufacturers, and other ecosystem players to align with the automotive industry's need to design sustainable and intelligent mobility for a better tomorrow."

Mike Gardner, Executive Director of the eSync Alliance, said: "The success of the eSync Alliance and our mission to achieve OTA standardization depends on the engagement of a broad range of manufacturing stakeholders. Cyient's long-standing work in the design engineering, Silicon, Software, and ECU fields makes it a very valuable member in our journey to achieve widespread adoption. This is, of course, a two-way partnership, and we believe that the benefits availed by Cyient through gaining access to the eSync specification will be significant."

Reality AI Explorer Tier offers free AI/ML development access
AEM introduces new generation of Automated Burn-In Systems
NPUs are emerging as the main rival to Nvidia’s AI dominance, says DAI Magister
Camtek receives a $20M order from a Tier-1 OSAT
Free samples of every STMicroelectronics NPI IC available from Anglia
NY CREATES and SEMI sign MoU
Major government investment to 'propel' Canada
QuickLogic announces $5.26 million contract award
ASNA and Athinia collaborate
Global sales forecast to reach record $109 billion in 2024
AMD to acquire Silo AI
Nanotronics unveils 'groundbreaking' Gen V AI Model
Aitomatic unveils SemiKong
Biden-Harris Administration reveals first CHIPS for America R&D facilities and selection processes
Collaboration to produce cutting-edge AI accelerator chips
Oxford Ionics breaks global quantum performance records
Adeia wins ECTC Award for paper on “Fine Pitch Die-to-Wafer Hybrid Bonding”
AEM introduces new generation of Automated Burn-In Systems
Sydney council forges vital semiconductor agreement
EV Group's EVG880 LayerRelease wins 2024 Best of West
Biden-Harris Administration to invest up to $1.6 billion
Cyient sets up subsidiary for semiconductor business
EMD Electronics network leaders honoured
Accenture acquires Cientra
Introducing Park FX200
Deep learning chipset market to surge to $72.8 billion by 2033
PI Innovation Award 2024: Nanobodies for Diagnostic and Therapeutic Applications
Graphcore joins Softbank Group
Kaman Measuring highlights high precision displacement sensors
Si2 reveals recipients of Annual Power of Partnerships Award
Advantest achieves ASPICE Level 2 Certification for V93000 SmarTest 8 Software
Semiconductors to become a trillion-dollar industry by 2030
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: