+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Heraeus Printed Electronics and SUSS MicroTec join forces

News

Heraeus Printed Electronics GmbH and SUSS MicroTec have signed a Joint Development Agreement (JDA) to pave the way for digital inkjet printing of metallic coatings for semiconductor manufacturing.

The partnership combines the core competences of both companies to enable digital printing solutions for mass production in the electronics industry for the first time.

Heraeus Printed Electronics, the worldwide only provider of a turnkey solution for digital inkjet printing on electronic components, offers metallic inks, deep process knowledge and printing systems. It complements the broad product portfolio of Heraeus to the electronics industry. The Prexonics® technology enables selective printing on different substrates for a wide range of applications such as shielding against electromagnetic interference (EMI), printing of conductive structures and metallization for heat dissipation.

"This collaboration represents the missing piece in the mosaic of scaling to mass production for us, having recently passed the important milestone of fulfilling the broad functional requirements of the semiconductor industry with our ground-breaking technology," said Franz Vollmann, Head of Heraeus Printed Electronics. "By combining our core expertise in metallic specialty inks and digital printing processes with the scaling competence of our strong partner SUSS MicroTec, we are setting a new industry standard for mass production in the semiconductor market."

SUSS MicroTec, known for its advanced equipment and process solutions for semiconductor manufacturing, brings its leading-edge automation platform and industrial inkjet production capabilities to the table. Their high-volume production equipment, JETx, designed to integrate various printhead and substrate technologies, expands the application potential of Heraeus' digital printing technology. SUSS MicroTec´s high production capacity and excellent global sales and service network support the smooth transfer of the solution into high-volume manufacturing.

"The integration of Heraeus' breakthrough ink technology and digital printing capabilities with our robust automation platforms is a testimonial to our pursuit of excellence and innovation. We are confident that our combined efforts will result in unprecedented production efficiencies and costs in line with current and future market expectations," said Dr. Robert Wanninger, Senior Vice President Advanced Backend Solutions of SUSS MicroTec.

The scope of the collaboration calls for the development of equipment that integrates Heraeus' digital printing technology, image processing software and advanced ink technology into SUSS MicroTec's automation and JETx platform. The end goal is a state-of-the-art system with a competitive total cost of ownership (TCO) that not only sets new standards in the industry, but also aligns with Heraeus and SUSS MicroTec's vision of cost and performance optimization. The product of this partnership looks to redefine the boundaries of what is possible and push forward into a future where technology serves as the cornerstone for innovation and growth.

Reality AI Explorer Tier offers free AI/ML development access
AEM introduces new generation of Automated Burn-In Systems
NPUs are emerging as the main rival to Nvidia’s AI dominance, says DAI Magister
Camtek receives a $20M order from a Tier-1 OSAT
Free samples of every STMicroelectronics NPI IC available from Anglia
NY CREATES and SEMI sign MoU
Major government investment to 'propel' Canada
QuickLogic announces $5.26 million contract award
ASNA and Athinia collaborate
Global sales forecast to reach record $109 billion in 2024
AMD to acquire Silo AI
Nanotronics unveils 'groundbreaking' Gen V AI Model
Aitomatic unveils SemiKong
Biden-Harris Administration reveals first CHIPS for America R&D facilities and selection processes
Collaboration to produce cutting-edge AI accelerator chips
Oxford Ionics breaks global quantum performance records
Adeia wins ECTC Award for paper on “Fine Pitch Die-to-Wafer Hybrid Bonding”
AEM introduces new generation of Automated Burn-In Systems
Sydney council forges vital semiconductor agreement
EV Group's EVG880 LayerRelease wins 2024 Best of West
Biden-Harris Administration to invest up to $1.6 billion
Cyient sets up subsidiary for semiconductor business
EMD Electronics network leaders honoured
Accenture acquires Cientra
Introducing Park FX200
Deep learning chipset market to surge to $72.8 billion by 2033
PI Innovation Award 2024: Nanobodies for Diagnostic and Therapeutic Applications
Graphcore joins Softbank Group
Kaman Measuring highlights high precision displacement sensors
Si2 reveals recipients of Annual Power of Partnerships Award
Advantest achieves ASPICE Level 2 Certification for V93000 SmarTest 8 Software
Semiconductors to become a trillion-dollar industry by 2030
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: