+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Gel-Probe product line receives successful qualification

News

Gel-Pak has announced the successful qualification of its Gel-Probe product line by several of the semiconductor industry’s top tier probe card manufactures.

Gel-Pak has worked collaboratively with the industry’s leading probe card manufactures to optimize its suite of Gel-Probe products and successfully qualify them as appropriate for both the in-line and off-line cleaning of probe cards. The materials have been found to effectively clean probe tips, control contact resistance (Cres), and in many cases outperform other polymer-based probe card cleaning sheets and wafers.

Gel-Pak’s Gel-Probe products are the next evolution in probe card cleaning materials, available in both abrasive and non-abrasive sheets and wafers. GelProbe ReFine is an abrasive elastomer designed to eliminate embedded and bonded debris from probe tips, ensuring effective probe card cleaning and improved contact resistance (Cres). The non-abrasive Gel-Probe ReMove elastomer sheets and wafers effectively capture and remove loose debris that accumulates on the probe tip and electrical contact area during probing. Both products are suitable for all types of micro-cantilevered probe needles and MEMs springs, as well as advanced vertical and array technologies. Gel-Pak’s R&D team is continuing to collaborate with industry leaders on its next generation of probe cleaning technologies designed for greater efficiency and to ultimately reduce the overall cost of test.

"I'm excited about our ongoing partnership with leaders in semiconductor test to develop cutting-edge probe cleaning materials that address emerging needs, enhance efficiency, and optimize wafer yield. Together, we leverage innovation, expertise, and foresight to shape the trajectory of semiconductor testing, driving progress and excellence in the industry,” says Joe Montano, Delphon Industries President and CEO.

“Semiconductor manufacturers rely on a rigorous testing process to validate ‘good die’. Data integrity requires clean probes and reliable contact, making Gel-Pak's Gel-Probe a crucial part of efficient memory and non-memory device testing”, said Dr. Jerry Broz, VP of Strategic Marketing. “This probe cleaning solution streamlines failure identification, maximizing first-pass yield and throughput, ultimately reducing the overall cost of test. By working with leading technical partners, Gel-Pak is continuously innovating solutions for reliable and cost-effective wafer and device testing.”

Mouser Electronics links with Morse Micro
Renesas introduces general-purpose 32-bit RISC-V MCUs
XMOS, DSP Concepts partner to unlock audio and voice DSP applications
Gel-Probe product line receives successful qualification
2023 Semiconductor market revenue down 9% from 2022
Critical Manufacturing showcases MES advanced capabilities for SMT at APEX
Imec demonstrates compact 32-channel silicon-based wavelength filter
NAND Flash contract prices expected to rise by 13–18%
Infineon introduces 80 V MOSFET OptiMOS 7
Pragmatic welcomes HRH The Princess Royal
Semiconductor industry: mobile and consumer are the beating heart
VTT works to develop wearable sensors
Omnivision highlights TheiaCel innovations
MCUs help customer systems conserve energy
Advanced packaging advances next wave of innovation in global chips manufacturing
Veeco releases sustainability report
Lam Research introduces breakthrough deposition technique
Complete vascularisation of organoids on microfluidic chip
Agile Analog delivers first full always-on IP subsystem
Simplifying automotive AI
Researchers design new analog chip architecture with high precision
Brand value surge propels NVIDIA to the top spot in the semiconductor industry
Cadence collaborates with Arm
SEMICON Southeast Asia 2024 - a global semiconductor showcase
Intel and Biden Admin announce up to $8.5 billion in direct funding
Advantest appoints new Group CEO
Costa Rica unveils semiconductor roadmap
Laser Thermal awarded DoD contract
eSync technology brings Cyient into the Alliance
Heraeus Printed Electronics and SUSS MicroTec join forces
scia System receives NIST order
The power of three
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: