+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

OMNIVISION unveils Global Shutter Sensors

News

At Automate 2024, OMNIVISION will showcase two new image sensors that feature excellent shutter efficiency and low-light performance for vision-guided robotics, logistics barcodes, high-speed inspection and intelligent transportation systems.

OMNIVISION has introduced two new CMOS global shutter (GS) image sensors for machine vision applications. OMNIVISION has created a new Machine Vision Unit, which will focus on creating innovative solutions for industrial automation, robotics, logistics barcode scanners and intelligent transportation systems (ITS).

OMNIVISION’s new GS sensors feature the industry’s smallest 2.2-micron (µm) backside-illuminated (BSI) pixel for high resolution in a compact design. The high-resolution, small-format GS sensors provide the highest shutter efficiency available on the market with the ability to capture high-speed moving objects clearly and accurately at high frame rates. They also feature high sensitivity, low noise and enhanced NIR quantum efficiency (QE) for industry-leading low-light performance.

Compared to the previous-generation 2.5µm frontside-illuminated (FSI) GS sensors, the 2.2µm BSI GS sensors can achieve 1.08x sensitivity with an F2.0 lens and 2.16x sensitivity with an F1.4 lens. The new OG05B1B is a 5-megapixel (MP) resolution CMOS monochrome GS sensor in a 1/2.53-inch optical format (OF). The new OG01H1B is a 1.5MP resolution CMOS monochrome GS sensor in a 1/4.51-inch OF.

“We see a huge demand in the machine vision market for 3D cameras and CMOS image sensors,” said Michael Wu, senior vice president, global sales and marketing, OMNIVISION. “With our strong technological backbone in Nyxel®, BSI and GS technology, we bring great innovation to the industry. Our new Machine Vision Unit will focus on understanding our customers’ needs and product roadmaps and address them with novel vision solutions.”

Both image sensors feature OMNIVISION’s Nyxel® near-infrared (NIR) technology, which boosts QE to 700-1050nm, enabling the capture of brighter images from farther away; PureCel®Plus-S stacked-die architecture for best-in-class image sensor performance; and CSP™ package technology for the smallest possible dimensions.

Key features of the OG05B1B GS image sensor:

● 2592 x 1944 resolution (5MP)

● Fast frame rate of 60fps

● High shutter efficiency of 106 dB

● Interface: 4-lane MIPI & DVP

● External trigger snapshot mode enabling back-end exposure control for improved accuracy

● Nyxel® boosting QE from 700 to 1050nm, 58% QE @850nm

Key features of the OG01H1B GS image sensor:

● 1440 x 1080 resolution (1.5MP)

● Fast frame rate of 120fps

● High shutter efficiency of 106 dB

● Interface: 4-lane MIPI & DVP

● External trigger snapshot mode enabling back-end exposure control for improved accuracy

● Nyxel® boosting QE from 700 to 1050nm, 58% QE @850nm

Reality AI Explorer Tier offers free AI/ML development access
AEM introduces new generation of Automated Burn-In Systems
NPUs are emerging as the main rival to Nvidia’s AI dominance, says DAI Magister
Camtek receives a $20M order from a Tier-1 OSAT
Free samples of every STMicroelectronics NPI IC available from Anglia
NY CREATES and SEMI sign MoU
Major government investment to 'propel' Canada
QuickLogic announces $5.26 million contract award
ASNA and Athinia collaborate
Global sales forecast to reach record $109 billion in 2024
AMD to acquire Silo AI
Nanotronics unveils 'groundbreaking' Gen V AI Model
Aitomatic unveils SemiKong
Biden-Harris Administration reveals first CHIPS for America R&D facilities and selection processes
Collaboration to produce cutting-edge AI accelerator chips
Oxford Ionics breaks global quantum performance records
Adeia wins ECTC Award for paper on “Fine Pitch Die-to-Wafer Hybrid Bonding”
AEM introduces new generation of Automated Burn-In Systems
Sydney council forges vital semiconductor agreement
EV Group's EVG880 LayerRelease wins 2024 Best of West
Biden-Harris Administration to invest up to $1.6 billion
Cyient sets up subsidiary for semiconductor business
EMD Electronics network leaders honoured
Accenture acquires Cientra
Introducing Park FX200
Deep learning chipset market to surge to $72.8 billion by 2033
PI Innovation Award 2024: Nanobodies for Diagnostic and Therapeutic Applications
Graphcore joins Softbank Group
Kaman Measuring highlights high precision displacement sensors
Si2 reveals recipients of Annual Power of Partnerships Award
Advantest achieves ASPICE Level 2 Certification for V93000 SmarTest 8 Software
Semiconductors to become a trillion-dollar industry by 2030
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: