Veeco lands laser annealing order I
Veeco Instruments says that a leading edge semiconductor company has placed an order for multiple laser annealing systems to accelerate the design and manufacturing of 2-nanometer gate-all-around logic semiconductor chips.
The order includes LSA201™ Laser Spike Annealing Systems in addition to an NSA500™ Nanosecond Annealing System. Gate-all-around is a vertical stacking of planar channels resulting in improved device drive current capability with minimal leakage, less power consumption, and overall enhanced performance.
“We are excited to have our annealing platforms chosen to accelerate next-generation gate-all-around logic device production to meet demand for growing markets such as artificial intelligence,” commented Adrian Devasahayam, Ph.D., Veeco’s Senior Vice President, Product Line Management. “Veeco’s LSA system is widely acknowledged as the optimum annealing solution for low thermal-budget applications in logic. The new NSA500 system offers customers superior performance, scalability, and productivity to enable product roadmaps. These benefits are essential to ensuring high device performance as node sizes decrease and production complexity increases.”
Laser spike annealing is a millisecond annealing technology used in front-end semiconductor manufacturing to lower the resistance of key transistor structures by activating dopants. Veeco’s LSA system is capable of high temperature annealing while staying within reduced thermal budgets of advanced devices at leading-edge nodes. The NSA500 system extends annealing capabilities to low thermal budget applications, like Backside Power Delivery and Contact Annealing for advanced nodes and material modification applications such as void-removal, recrystallization, and grain growth. These annealing steps are instrumental in determining the electrical properties and performance of the resulting devices.
