Highlights of the SMTconnect at a glance
The SMTconnect trade fair for microelectronics will take place in Nuremberg, Germany from 11 – 13. June 2024. Visitors can look forward to a wide range of products and services on site and make new contacts within the industry.
With its focus on Surface Mount & Microelectronics Manufacturing Technologies, the SMTconnect is unique in Europe and will once again offer visitors in-depth insights into topics and trends relating to the electronics manufacturing industry this year. The trade fair also serves as a platform for numerous networking opportunities. Asys, Essemtec, FUJI Europe, Göpel electronic, SmartRep, Techvalley, Viscom and many other exhibitors are already expecting valuable discussions with stakeholders during the event.
The latest forum program
At this year's SMTconnect forum, visitors can look forward to specific presentations by experts from industry and science on the following topics:
· Manufacturing in power electronics
· AI in electronics production / Industry 4.0
In cooperation with the editors of EPP the exhibition forum EPP will host a series of keynote speeches and presentations on current trends and future challenges in the field of power electronics manufacturing. Aspects such as improving power density, increasing efficiency and extending the service life of electronic components will be discussed. Insights into these topics will be provided by Nils Thielen, Director of the Electronics Production Research Sector at the FAPS Institute, University of Erlangen-Nuremberg, with a keynote speech on “Trends from a research perspective” and Dr. Markus Meier, Group Leader Reliability & Surfaces at Zestron, with a presentation on “HAST quality testing of epoxy mold compounds based on iodine vapor testing and impedance spectroscopy”.
Further presentations on the above-mentioned key topics will be given by Dr. Sandra Engle, speaker from the Productronic department, and Volker Pape, member of the VDMA Executive Board, on “VDMA Productronic network activities for mechanical engineering in the semiconductor value chain” and Olesja Kopp, Product and Innovation Manager at Viscom, on “The next level of effective inspection processes”.
Annual visitor highlight: The “Future Packaging” production line
Under the motto “See the REAL DEAL”, the Fraunhofer Institute for Reliability and Microintegration (IZM) is presenting its production line at the SMTconnect this year. In particular, the line will be examining how a higher degree of digitalization and automation can make production processes more robust against disruptions and external influences. Participating companies include F&K Delvotec Bondtechnik GmbH, IBL-Löttechnik GmbH and Siemens AG. Visitors can take part in live guided tours every day at 10 a.m., 1 p.m. or 3 p.m. and gain valuable insights and specialist know-how.
