Accelerating lab to fab
With the global semiconductor industry gearing up to meet the huge anticipated growth in demand for miniaturized, more resource-efficient electronics for multiple applications, CEA-Leti will present its most recent innovations and breakthroughs to help meet that demand at Leti Innovation Days, June 25-27 in Grenoble.
Leti Innovation Days 2024 will offer more than 1,000 semiconductor industry professionals a close-up look at new microelectronic solutions that will help power, control and enable ultra-sophisticated devices and equipment across the industrial, medical, automotive and consumer markets.
“CEA-Leti is committed to getting new semiconductor technologies from lab to fab swiftly and efficiently,” said CEA-Leti CEO Sébastien Dauvé. “We invest extensively in our pilot lines each year and, as chip production ramps up around the globe, this year presents unprecedented opportunities for CEOs, research & development directors, engineers and visionaries to innovate and deliver.”
Presentations, workshops and discussions will cover many timely and critical topics for the industry, ranging from AI, edge computing, augmented reality and green technologies to health care, telecommunications and optics.
“As always at CEA-Leti, partnerships will be instrumental to helping industry leaders and innovators accelerate their progress from lab to fab with relevant, robust and reliable products for their key markets,” said Michael Tchagaspanian, CEA-Leti EVP strategic partnerships & event chairman.
Plenaries, Workshops, Startups
Keynote Speakers
§ Stefan Finkbeiner, CEO & GM, Bosch Sensortec
§ Laura Matz, CSTO, Merck
§ Bernhard Quendt, CTO, Thales Group
§ Sanjay Natarajan, SVP & GM, Components Research, Intel
§ Lia Li, CEO & Founder, Zero Point Motion
§ Fabio Gualandris, President Quality, Manufacturing & Technology, STMicroelectronics
§ Jean-Philippe Fricker, Founder & Chief System Architect, Cerebras Systems
§ Laith Altimime, President, Semi Europe
§ David Anderson, President, NY CREATES
§ Sébastien Dauvé, CEO, CEA-Leti
§ Theodore Sizer, EVP, Optical Research, Nokia Bell Labs
§ Christina Strohrmann, Director Advanced Engineering, Bosch Sensortec
§ Coby Hanoch, CEO, Weebit Nano
§ Leroy Liu, CSO, Realtek
§ Emmanuel Sabonnadière, EVP Division Automotive & Green Industry, Soitec
Conferences
Electronics & Sustainability
Tech for Health
3D Heterogeneous Integration
Sense & Act
New Materials for Computing
RF & Telecommunications
Partner's Corner
Speak with CEA-Leti's partners from the entire semiconductor value chain:
Aniah
Electronmec
Serma Microelectronics
SET Smart Equipment Technology
Carnot Institutes network
EVG
SCREEN
MICROTEST
TECHNIC
SVCS
Tektronix
Soitec
Teledyne
PREVAIL
NplusT
INFICON
Murata
ClassOne
IC’Alps
Equans
Minalogic
Startups’ Corner
ADMIR
NGSENS
Direct Analysis
Quobly
SCINTIL Photonics
Injectpower
SteerLight
Wise-integration
eLichens
Ecylpia
Arise
Orioma
Magellan Program
Business Meetings
With dozens of semiconductor companies from around the world represented, Leti Innovation Days is where CEOs and CTOs come to meet. Targeted business meetings are the ideal way to find your next technology partner or provider.
Sponsors
Soitec, Schneider Electric, Siemens, Equans, Le Groupe BBM, BM&A, KELTEN, Weebit Nano, Global Foundries, SCREEN, Intel Foundry, ASML, Synopsys, EBARA, TEL, PREVAIL, NY CREATES, STMicroelectronics, AIXTRON, Electronmec, EVG, LAM Research, Entegris, Pfeiffer Vacuum, Banque Populaire Auvergne Rhône Alpes, Technic, Veeco, Edwards, ASM, Applied Materials, Lynred, Thermo Fisher, and with support from Auvergne Rhône-Alps Region, Carnot Institutes network, Grenoble Alpes Métropole and SEMI.
Media Partners
EE Times Europe, EE News Europe, Microwave Journal, Silicon Semiconductor, Compound Semiconductor, Times Tech, SemiWiki, Pradeep’s Techpoints and Yole Group.
