Loading...
News Article

Alphawave Semi collaborates with Arm

News

Arm Neoverse CSS-based CPU chiplet with ultra-high-speed interfaces and advanced packaging delivers scalable performance for AI, HPC and networking infrastructure.

Alphawave Semi, a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, has collaborated with Arm on the development of an advanced compute chiplet built on Arm® Neoverse™ Compute Subsystems (CSS) for artificial intelligence/machine learning (AI/ML), high-performance compute (HPC), data centre and 5G/6G networking infrastructure applications. The development follows last year’s announcement that Alphawave Semi joined Arm Total Design, an ecosystem building custom silicon solutions based on Arm Neoverse CSS.



Alphawave Semi’s chiplet-based custom silicon design platform adds a differentiator in our portfolio that includes IO extension chiplets, memory chiplets, and compute chiplets, as well as Alphawave Semi’s ultra-high-speed connectivity IP and advanced packaging capabilities. This compute chiplet lineup features an Arm Neoverse N3 CPU core cluster and the Arm Coherent Mesh Network (CMN) ensuring efficient, scalable performance. Available on industry-leading process nodes, the technology allows customers to accelerate development and reduce the time-to-market (TTM) of a new generation of custom system-on-chip (SoC) technologies. These advanced SoCs support the rapid deployment of high-performance digital infrastructure, enabling the creation of custom silicon solutions tailored to specific needs.



In collaboration with Arm, Alphawave Semi enhances this setup with their advanced packaging techniques and a leading-edge portfolio of connectivity technologies, including PCIe Gen 6.0 and 7.0, Universal Chiplet Express (UCIe), 112/224G Ethernet and HBM subsystems. This strategic integration ensures that the Arm-based compute chiplet delivers robust performance and flexibility, catering to next-generation HPC, data center, AI/ML, and 5G/6G infrastructure needs while accelerating time-to-market for customers.



“Our Arm-based compute chiplet is a critical component in Alphawave Semi’s custom silicon platform and a demonstration of both our IP, SoC and packaging capabilities and our successful strategic partnership with Arm,” says Mohit Gupta, Senior VP & GM, Custom Silicon & IP. Alphawave Semi. “Bringing together the Arm Neoverse CSS platform with Alphawave Semi’s advanced and proven IP drives innovation across the chiplet ecosystem and simplifies the development of critical custom silicon for AI, HPC and other demanding digital infrastructure applications.”



“Arm Total Design is fostering a rapidly growing ecosystem around custom silicon and enabling chiplet innovations to take on increasingly complex computing requirements,” said Eddie Ramirez, vice president of go-to-market, Infrastructure Line of Business, Arm. “Alphawave Semi’s new advanced compute chiplet is a fantastic example of how industry-leading companies are leveraging the performance-optimization and power efficiency benefits of Neoverse CSS to get to market faster and power the next-generation AI and HPC workloads.”

Silicon photonics: accelerating growth in the race for high-speed optical interconnects
CCD-in-CMOS technology enables ultra-fast burst mode imaging
2025 6G A look forward
Critical Manufacturing climbs Deloitte’s Technology Fast 50
Semiconductors: The most important thing you probably know the least about
Imec and partners unveil SWIR sensor with lead-free quantum dot photodiodes
Lattice introduces small and mid-range FPGA offerings
SEMI and SMT inspection solutions at NEPCON Japan 2025
Nordic Semiconductor and Kigen demonstrate Remote SIM Provisioning for Massive IoT
Spirent collaborates with Siemens
Quobly forges strategic collaboration with STMicroelectronics
New standards in pressure measurement systems for the semiconductor industry
IBM delivers optics breakthrough
Semiconductor equipment sales to reach $139 Billion in 2026
Marvell introduces 1.6 Tbps LPO Chipset
ACM research strengthens Atomic Layer Deposition portfolio
CEA-Leti demonstrates embedded FeRAM platform compatible with 22nm FD-SOI node
Lattice introduces small and mid-range FPGA offerings
Solace unlocks full potential of event-driven integration
Advantest to showcase latest test solutions at SEMICON Japan 2024
CEA-Leti device integrates light sensing and modulation
Nordic launches Thingy:91 X prototyping platform for cellular IoT and Wi-Fi locationing
Imec achieves seamless InP Chiplet integration on 300mm RF Silicon Interposer
High-precision SMU
Powering India’s energy future
China’s Nvidia probe puts global investors ‘on notice’
POET Technologies appoints new director
Imec demonstrates core building blocks of a scalable, CMOS-fab compatible superconducting digital technology
Imec proposes double-row CFET for the A7 technology node
ULVAC launches new deposition system
Beebolt and SEMI Announce Strategic Partnership to Drive Supplier Resilience and Agility
esmo group introduces Automated Final Test Manipulator
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: