KYZEN to showcase Multi-Process Power Module Cleaner
KYZEN, a global leader in innovative environmentally responsible cleaning chemistries, is excited to announce its participation in SEMICON West 2024, taking place July 9–11 at the Moscone Center in San Francisco.
KYZEN will be exhibiting in Booth 1841, where attendees will have the opportunity to learn about their latest advancements, including the spotlight product: MICRONOX® MX2123 Multi-Process Power Module Cleaner.
MICRONOX MX2123 is an advanced, aqueous, multi-phase cleaning solution specifically engineered to remove flux residues from a variety of IGBT module devices that utilize a combination of copper, silver and nickel DBC substrates, as well as PCBs. Its meticulously balanced formula ensures superior surface conditions for subsequent wire bonding and potting processes.
Key Features of MICRONOX® MX2123:
Exceptional Cleaning Performance: Designed to effectively eliminate flux residues, MICRONOX MX2123 ensures optimal surface conditions for critical downstream processes.
Versatile Application: Suitable for use in both Spray-In-Air in-line and Ultrasonic Immersion cleaning systems, providing flexibility for diverse manufacturing setups.
Low Temperature and Concentration Efficiency: Operates effectively at low temperatures and concentrations, reducing energy consumption and operational costs.
Enhanced Surface Preparation: Ensures exceptional surface conditions for subsequent wire bonding and potting, crucial for high-reliability applications in power devices and advanced packaging.
In addition to MICRONOX MX2123, KYZEN will also discuss its range of other high-performance cleaning solutions tailored for power devices and advanced packaging applications. The company’s experts will be available at Booth 1841 to provide insights and answer questions about their comprehensive product portfolio.
